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SGM8770XS8G

Public Made by Adom

by adom

SGMICRO Comparators, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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SGM8770XS8G

SGMICRO · Comparators · SOIC-8

SGM8770XS8G from SGMICRO, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUTA output Open-drain output of comparator A that requires an external pull-up resistor; it can sink up to a short-circuit current of 36 mA typical at 25°C.
2 -INA input Inverting input of comparator A; input voltages must stay between (-VS) - 0.3V and (+VS) + 0.3V, and the common-mode range is -VS to (+VS) - 1.5V.
3 +INA input Non-inverting input of comparator A; input voltages must stay above (-VS) - 0.3V, and the common-mode range is -VS to (+VS) - 1.5V.
4 -VS power_in Negative power supply rail; the device operates from 2.8V to 36V single supply or ±1.4V to ±18V dual supplies.
5 +INB input Non-inverting input of comparator B; input voltages must stay above (-VS) - 0.3V, and the common-mode range is -VS to (+VS) - 1.5V.
6 -INB input Inverting input of comparator B; input voltages must stay between (-VS) - 0.3V and (+VS) + 0.3V, and the common-mode range is -VS to (+VS) - 1.5V.
7 OUTB output Open-drain output of comparator B that requires an external pull-up resistor; it can sink up to a short-circuit current of 36 mA typical at 25°C.
8 +VS power_in Positive power supply rail; the device operates from 2.8V to 36V single supply or ±1.4V to ±18V dual supplies.

Key specifications

Parameter Value
Manufacturer SGMICRO
Package SOIC-8
Category Amplifiers/Comparators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Offset Voltage VOS 0.6 2.4 mV VCM = 0V, +25℃ 4
Input Offset Voltage VOS 2.8 mV VCM = 0V, Full (-40℃ to +125℃) 4
Input Bias Current IB -240 20 240 pA VCM = 0V, +25℃ 4
Input Offset Current IOS -320 20 320 pA VCM = 0V, +25℃ 4
Maximum Input Difference Bias Current /IID/ 2.2 3 μA VS = ±18V, VID = ±18V, +25℃ 4
Maximum Input Difference Bias Current /IID/ 5 μA VS = ±18V, VID = ±18V, Full (-40℃ to +125℃) 4
Common Mode Rejection Ratio CMRR 96 116 dB VS = ±18V, VCM = -VS to (+VS) - 1.5V, +25℃ 4
Common Mode Rejection Ratio CMRR 80 dB VS = ±18V, VCM = -VS to (+VS) - 1.5V, Full (-40℃ to +125℃) 4
Power Supply Rejection Ratio PSRR 98 116 dB VS = 2.8V to 36V, +25℃ 4
Power Supply Rejection Ratio PSRR 95 dB VS = 2.8V to 36V, Full (-40℃ to +125℃) 4
Large-Signal Differential Voltage Amplification AVD 90 100 dB VS = 36V, VOUT = 0.1V to 28.8V, RL = 120kΩ to VS, +25℃ 4
Large-Signal Differential Voltage Amplification AVD 87 dB VS = 36V, VOUT = 0.1V to 28.8V, RL = 120kΩ to VS, Full (-40℃ to +125℃) 4
Output Voltage Swing from Rail VOL 200 280 mV ISINK = 8mA, VID = -0.2V, +25℃ 4
Output Voltage Swing from Rail VOL 410 mV ISINK = 8mA, VID = -0.2V, Full (-40℃ to +125℃) 4
Output Short-Circuit Current ISINK 24 36 mA VOL = (-VS) + 1.5V, VID = -0.2V, +25℃ 4
High-Level Output Current IOH 0.4 0.8 μA VOH = 2.8V, VID = 0.2V, +25℃ 4
High-Level Output Current IOH 1 μA VOH = 2.8V, VID = 0.2V, Full (-40℃ to +125℃) 4
High-Level Output Current IOH 6 9 μA VOH = 36V, VID = 0.2V, +25℃ 4
High-Level Output Current IOH 62 μA VOH = 36V, VID = 0.2V, Full (-40℃ to +125℃) 4
Total Supply Current IS 310 380 μA IOUT = 0mA, +25℃ 4
Total Supply Current IS 430 μA IOUT = 0mA, Full (-40℃ to +125℃) 4
Propagation Delay (High to Low) tPHL 75 ns Overdrive = 10mV, VS = ±2.5V, CL = 15pF, +25℃ 4
Propagation Delay (High to Low) tPHL 45 ns Overdrive = 100mV, VS = ±2.5V, CL = 15pF, +25℃ 4
Fall Time tFALL 15 ns Overdrive = 10mV, VS = ±2.5V, CL = 15pF, +25℃ 4
Operating Temperature Range -40 125 ℃ 2
Supply Voltage, +VS to -VS 40 V 2
Differential Input Voltage, /VID/ /VID/ 40 V 2
Junction Temperature 150 ℃ 2
Storage Temperature Range -65 150 ℃ 2
Lead Temperature (Soldering) 260 ℃ 10s 2

CAD (KiCad official)

  • Symbol: SGM8770XS8G
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: sgm8770xs8g-etched.step / sgm8770xs8g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sgm8770xs8g.step / sgm8770xs8g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SGMICRO datasheet (12 pp, sha256 2766ee685d74a4cb, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF