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Contents

README

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SGM809B-SXN3LG

SGMICRO · Supervisor And Reset ICs · SOT-23

SGM809B-SXN3LG from SGMICRO, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference pin for the supervisor.
2 nRESET output Active-low reset output (push-pull on SGM809B): it remains low while VCC is below the reset threshold and for 240ms (TYP) after VCC rises above the threshold.
3 VCC power_in Power supply voltage that is monitored; the datasheet specifies operation from 1V to 5.5V at TA = +25℃ (1.25V to 5.5V over -40℃ to +125℃).

Key specifications

Parameter Value
Manufacturer SGMICRO
Package SOT-23
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (VCC) VCC 1 5.5 V TA = +25℃ 5
Supply voltage (VCC) VCC 1.25 5.5 V TA = -40℃ to +125℃ 5
Supply current 300 430 nA VCC < 3.6V, SGM8_R/S/T, TA = +25℃ 5
Supply current 590 nA VCC < 3.6V, SGM8_R/S/T, TA = -40℃ to +125℃ 5
Reset voltage threshold (SGM8_S) VTH 2.86 2.93 2.998 V VCC falling, TA = +25℃ 5
Reset voltage threshold (SGM8_S) VTH 2.841 3.018 V VCC falling, TA = -40℃ to +125℃ 5
Reset active timeout period 150 240 370 ms TA = +25℃ 5
Reset active timeout period 110 400 ms TA = -40℃ to +125℃ 5
RESET/nRESET output voltage low (SGM809B-R/S/T) VOL 0.3 V VCC = VTH(MIN), ISINK = 1.2mA 5
RESET/nRESET output voltage low (SGM809B-R/S/T/M/J) VOL 0.3 V VCC > 1V, ISINK = 50μA 5
Hysteresis voltage ratio VHYS 0.5 % VCC rising 5
Reset threshold temperature coefficient 35 ppm/℃ 5
VCC to RESET/nRESET delay 110 μs VCC falling from (VTH + VHYS) × (1 + 5%) to VTH × (1 - 5%) 5
Operating temperature range -40 125 ℃ 3
VCC VCC -0.3 6 V 3
RESET, nRESET voltage -0.3 V upper limit printed as VCC + 0.3V 3
Rate of rise, VCC 100 V/μs 3
Junction temperature 150 ℃ 3
Storage temperature range -65 150 ℃ 3
Lead temperature (soldering) 260 ℃ 10s 3
Package thermal resistance, θJA θJA 250 ℃/W SOT-23-3 3

CAD (KiCad official)

  • Symbol: SGM809B-SXN3LG
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: sgm809b-sxn3lg-etched.step / sgm809b-sxn3lg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sgm809b-sxn3lg.step / sgm809b-sxn3lg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SGMICRO datasheet (13 pp, sha256 027d6719a2f5bf86, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF