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Contents

README

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SGM6230YPS8G

SGMICRO · DC-DC Converters · ESOP-8

SGM6230YPS8G from SGMICRO, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BS input High-side gate drive boost input; a 10Ω resistor between SW and the BS capacitor is strongly recommended to reduce SW spike voltage, and the BS voltage is rated VSW - 0.3V to VSW + 6V.
2 IN power_in Power input that powers the device and the step-down converter switches; the datasheet specifies an input range of 4.5V to 38V and a sufficiently large bypass capacitor to GND to eliminate input noise.
3 SW power_out Power switching output that connects to the inductor; a capacitor is placed between SW and BS to supply the high-side switch, and SW is rated -0.5V to VIN + 0.3V.
4 GND power_in Ground pin; the exposed pad is connected to the backside of GND and must be connected to the GND plane.
5 FB input Feedback input connected to the resistor divider between output and ground to set the output voltage, with a feedback reference of 0.776V to 0.824V (0.8V typical).
6 COMP passive Compensation node for the regulation control loop, where an additional capacitor between COMP and GND may be needed.
7 EN input Enable input that turns the regulator on when driven high (above 1.2V VIH) and off when driven low (below 0.4V VIL); the output is discharged when the IC is off.
8 SS input Soft-start control input where a capacitor between SS and GND sets the soft-start period (10ms with 0.1μF), and disconnecting SS disables the soft-start function.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer SGMICRO
Package ESOP-8
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VIN -0.3 40 V 2
All Other Pins -0.3 6 V 2
Storage Temperature Range -65 150 ℃ 2
Junction Temperature 150 ℃ 2
Lead Temperature (Soldering) 260 ℃ Soldering, 10s 2
Operating Temperature Range -40 85 ℃ 2
Input Voltage Range VIN 4.5 38 V 4
Feedback Voltage VFB 0.776 0.8 0.824 V 4
Shutdown Supply Current ISHDN 10 18 μA VEN = 0V 4
Quiescent Supply Current IQ 0.8 1.7 mA VEN = 2.6V, VFB = 1V 4
Error Amplifier Transconductance GEA 500 800 1120 μA/V ΔVFB = ±12.5mV 4
EN Pull-Up Current 0.8 1.4 2 μA VEN = 0V 4
Oscillator Frequency fS 335 385 435 kHz 4
Short-Circuit Oscillator Frequency 25 38 60 kHz VFB = 0V 4
Under-Voltage Lockout Threshold (VIN Rising) 3.5 3.8 4.2 V VIN Rising 4
Thermal Resistance, Junction-to-Ambient (SOIC-8 Exposed Pad) θJA 50 ℃/W SOIC-8 (Exposed Pad); printed as a single value under Absolute Maximum Ratings, no min/typ/max label 2

CAD (KiCad official)

  • Symbol: SGM6230YPS8G
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)
  • 3D model files: sgm6230yps8g-etched.step / sgm6230yps8g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sgm6230yps8g.step / sgm6230yps8g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SGMICRO datasheet (10 pp, sha256 0239e2476e6419ac, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF