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SGM61412AXTN6G

SGMICRO · DC-DC Converters · SOT-23-6L

SGM61412AXTN6G from SGMICRO, in a SOT-23-6L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin that is the reference for the input and regulated output voltages and requires special layout considerations.
2 SW output Switching node output that connects to the output inductor and bootstrap capacitor and should be kept small on the PCB to minimize capacitive coupling, noise coupling and radiation.
3 VIN power_in Power supply input for 4.5V to 42V operation that powers the control circuitry, is monitored by UVLO, and must be decoupled to GND by input capacitors placed as close as possible to the GND pin.
4 FB input Feedback input that the SGM61412 regulates to 0.83V, connected to the midpoint of the output feedback resistor divider.
5 EN input Active-high enable input with an internal pull-up current source that disables the device when pulled below 0.9V and enables it when floated, with input UVLO adjustable by a resistor divider.
6 BOOT power_out Bootstrap pin that provides a drive voltage above VIN to the high-side power switch, with a 0.1µF CBOOT required as close as possible between this pin and SW.

Key specifications

Parameter Value
Manufacturer SGMICRO
Package SOT-23-6L
Category Power Management (PMIC)
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Input Voltage VIN 4.5 42 V 4
Under-Voltage Lockout Threshold VUVLO 4 4.25 4.5 V 4
VIN Quiescent Current, Shutdown IQ 1.2 2 µA VEN/UV = 0V 4
VIN Quiescent Current, Sleep Mode (SGM61412A) IQ 55 85 µA VEN/UV = 2V, Non-switching, VIN ≤ 36V 4
Feedback Reference Voltage VFB 0.805 0.83 0.855 V 4
Feedback Pin Input Current IFB 0.1 1 µA VFB = 1V 4
Switching Frequency fSW 0.85 1.2 1.55 MHz 4
Switch Leakage Current, high-side ISW_H 0.1 1 µA VSW = 42V 4
Switch Leakage Current, low-side ISW_L 0.1 1 µA VSW = 0V 4
High-side NMOS Current Limit ILIM 1.6 2 2.4 A TJ = +25℃ 4
High-side NMOS On-Resistance RDSON 230 410 mΩ ILOAD = 0.1A 4
Low-side NMOS On-Resistance 130 230 mΩ ILOAD = 0.1A 4
EN Input High Voltage VIH 1.2 1.3 1.4 V VEN Rising 4
EN Input Low Voltage VIL 0.8 0.9 1 V VEN Falling 4
Enable Leakage Current (VEN = 42V) IEN 0.1 1 µA VEN = 42V 4
Enable Leakage Current (VEN = 0V) IEN -1 -0.4 µA VEN = 0V 4
VIN to GND VIN -0.3 45 V 2
EN to GND EN -0.3 V Maximum printed as VIN + 0.3V 2
FB to GND FB -0.3 5.5 V 2
SW to GND SW -0.3 V Maximum printed as VIN + 0.3V 2
BOOT to SW BOOT-SW -0.3 5.5 V 2
Junction Temperature TJ 150 ℃ 2
Storage Temperature Range TSTG -65 150 ℃ 2
Lead Temperature (Soldering) 260 ℃ Soldering, 10s 2
Operating Junction Temperature Range TJ -40 125 ℃ 2
Operating Ambient Temperature Range TA -40 125 ℃ 2
Package Thermal Resistance, TSOT-23-6 θJA 132 ℃/W 2

CAD (KiCad official)

  • Symbol: SGM61412AXTN6G
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6L (KiCad packages3D, STEP)
  • 3D model files: sgm61412axtn6g-etched.step / sgm61412axtn6g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sgm61412axtn6g.step / sgm61412axtn6g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SGMICRO datasheet (21 pp, sha256 95f1250710f8e67b, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF