component
SGM61230XTN6G
Public Made by Adomby adom
SGMICRO DC-DC Converters, TSOT-23-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSGM61230XTN6G
SGMICRO · DC-DC Converters · TSOT-23-6
SGM61230XTN6G from SGMICRO, in a TSOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Device ground reference pin for the converter. |
| 2 | SW | output | Switching node connecting the internal lower and upper power MOSFETs; connect it to the output inductor and the bootstrap capacitor, with SW rated -0.3V to 30V (-5V to 30V for 20ns transients). |
| 3 | VIN | power_in | Input supply pin that powers the control circuitry and power converter over 4.5V to 28V, protected by UVLO, and should be decoupled close to VIN and GND with high-frequency ceramic capacitors. |
| 4 | FB | input | Feedback sense pin for output voltage programming, normally regulated at 0.603V, with a recommended voltage range of -0.1V to 3V. |
| 5 | EN | input | Device enable pin that runs the device when high and shuts it down when low, with the pin left floating enabling the device; recommended voltage range is -0.1V to 5.5V. |
| 6 | BOOT | output | Bootstrap pin that requires a 0.1µF CBOOT between BOOT and SW placed close to the device with no series resistor, with a recommended BOOT-SW voltage of -0.1V to 5.5V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | SGMICRO |
| Package | TSOT-23-6 |
| Category | Power Management (PMIC) |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage Range | VIN | 4.5 | 28 | V | 4 | ||
| EN Terminal Input Threshold, High (rising) | VIH | 1.19 | 1.33 | V | Rising | 4 | |
| EN Terminal Input Threshold, Low (falling) | VIL | 0.93 | 1.1 | V | Falling | 4 | |
| Feedback Voltage | VFB | 0.585 | 0.603 | 0.62 | V | VIN = 12V, TJ = +25℃ | 4 |
| High-side FET On-Resistance | RDSON_HS | 66 | 116 | mΩ | VBOOT - VSW = 5V | 4 | |
| Low-side FET On-Resistance | RDSON_LS | 36 | 63 | mΩ | VIN = 12V | 4 | |
| High-side Current Limit | ILIM_HS | 3.4 | 4 | 4.6 | A | Maximum inductor peak current, TJ = +25℃ | 4 |
| UVLO Threshold Voltage, Rising VIN | VUVLO | 4.1 | 4.5 | V | Rising VIN | 4 | |
| UVLO Threshold Voltage, Falling VIN | VUVLO | 3.4 | 3.7 | V | Falling VIN | 4 | |
| Switching Frequency | fSW | 340 | 410 | 480 | kHz | 4 | |
| Input Voltage Range (absolute maximum) | VIN | -0.3 | 30 | V | 2 | ||
| EN and BOOT-SW Voltages (absolute maximum) | -0.3 | 6 | V | 2 | |||
| SW Voltage (absolute maximum) | -0.3 | 30 | V | 2 | |||
| SW Voltage, 20ns transient (absolute maximum) | -5 | 30 | V | 20ns transient | 2 | ||
| FB Voltage (absolute maximum) | -0.3 | 3.5 | V | 2 | |||
| Junction Temperature (absolute maximum) | TJ | 150 | ℃ | 2 | |||
| Storage Temperature Range | TSTG | -65 | 150 | ℃ | 2 | ||
| Lead Temperature | 260 | ℃ | Soldering, 10s | 2 | |||
| Input Voltage Range (recommended) | VIN | 4.5 | 28 | V | 2 | ||
| EN and BOOT-SW Voltages (recommended) | -0.1 | 5.5 | V | 2 | |||
| SW Voltage (recommended) | -0.1 | 28 | V | 2 | |||
| FB Voltage (recommended) | -0.1 | 3 | V | 2 | |||
| Operating Junction Temperature Range | TJ | -40 | 125 | ℃ | 2 | ||
| Non-Switching Quiescent Current | IQ | 25 | µA | VEN = 5V, VFB = 1V | 4 | ||
| Shutdown Supply Current | ISD | 2 | µA | EN = GND | 4 | ||
| EN Terminal Leakage Current, IIL | IIL | 0.45 | μA | VEN = 0.5V | 4 | ||
| EN Terminal Leakage Current, IIH | IIH | 1.44 | μA | VEN = 1.5V | 4 | ||
| Low-side Current Limit | ILIM_LS | 3.4 | A | Maximum inductor valley current, TJ = +25℃ | 4 | ||
| UVLO Hysteresis | VUVLO_HYS | 400 | mV | 4 | |||
| Thermal Shutdown | TSHDN | 165 | ℃ | Rising temperature | 4 | ||
| Thermal Shutdown Hysteresis | THYS | 10 | ℃ | 4 | |||
| Soft-Start Time | tSS | 5 | ms | 4 | |||
| Package Thermal Resistance, junction-to-ambient (TSOT-23-6) | θJA | 123 | ℃/W | TSOT-23-6, as printed in Absolute Maximum Ratings | 2 | ||
| Package Thermal Resistance, junction-to-case top (TSOT-23-6) | RθJC(TOP) | 45 | ℃/W | TSOT-23-6, as printed in Absolute Maximum Ratings | 2 |
CAD (KiCad official)
- Symbol:
SGM61230XTN6G - Footprint:
Package_TO_SOT_SMD:TSOT-23-6 - 3D model: TSOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
sgm61230xtn6g-etched.step/sgm61230xtn6g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sgm61230xtn6g.step/sgm61230xtn6g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: SGMICRO datasheet (17 pp, sha256
27e53c53f677ff45, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).