# SGM4027-3.3XN3LG

**SGMICRO** · Voltage Reference · SOT-23

SGM4027-3.3XN3LG from SGMICRO, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN | power_in | Power supply input; the datasheet specifies operation from (VREF + 0.2V) up to 5.5V, with VIN to GND absolute maximum of 6.0V, and recommends a 0.47µF bypass capacitor at this pin for stability. |
| 2 | OUT | output | Reference voltage output; load current is limited to 10mA (MAX) and a 2µF to 22µF capacitor should be connected at this pin for stability. |
| 3 | GND | power_in | Ground reference for the device. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | SGMICRO |
| Package | SOT-23 |
| Category | Power Management (PMIC) |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Initial Accuracy |  | -0.1 |  | 0.1 | % |  | 4 |
| Solder Heat Resistance Shift |  | -0.03 |  | 0.03 | % |  | 4 |
| Output Voltage Temperature Drift | dVOUT/dT |  | 10 | 35 | ppm/℃ | -40℃ ≤ TA ≤ +125℃ | 5 |
| Load Regulation | ΔVO(ΔIL) |  | 5 | 15 | ppm/mA | -10mA < ILOAD < 10mA | 5 |
| Dropout Voltage | VIN - VOUT |  | 5 | 200 | mV |  | 5 |
| Quiescent Current | IQ |  | 245 | 320 | µA |  | 5 |
| Quiescent Current | IQ |  |  | 340 | µA | -40℃ ≤ TA ≤ +125℃ | 5 |
| Power Supply Range | VCC | 3 |  | 5.5 | V |  | 5 |
| Input Voltage | VIN |  |  | 5.5 | V | IO = 0mA; minimum printed as MAX (VREF + 0.2V, 3.0V) | 2 |
| Load Current | ILOAD |  |  | 10 | mA |  | 2 |
| Operating Temperature Range |  | -40 |  | 125 | ℃ |  | 2 |
| Junction Temperature |  |  |  | 150 | ℃ |  | 2 |
| Storage Temperature Range |  | -65 |  | 150 | ℃ |  | 2 |
| Lead Temperature (Soldering) |  |  |  | 260 | ℃ | 10s | 2 |
| Package Thermal Resistance SOT-23 | θJA |  | 254 |  | ℃/W |  | 2 |

## CAD (KiCad official)

- Symbol: `SGM4027-3.3XN3LG`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `sgm4027-3-3xn3lg-etched.step` / `sgm4027-3-3xn3lg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sgm4027-3-3xn3lg.step` / `sgm4027-3-3xn3lg.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [SGMICRO datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590903529005527040) (17 pp, sha256 `1c79af7b8fce4ac2`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sgm4027-3-3xn3lg-datasheet.pdf)