# SF-1206HV30M-2

**BOURNS** · Disposable Fuses · 1206

SF-1206HV30M-2 from BOURNS, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | BOURNS |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating temperature |  | -55 |  | 125 | °C | Construction: operating temperature | 2 |
| Resistance tolerance | R | -25 |  | 25 | % | Resistance measured with ≤10 % rated current at 25 °C ambient | 1 |
| Soldering heat resistance DCR change |  |  |  | 10 | % | One dip at 260 °C for 60 seconds (MIL-STD-202 Method 210) | 1 |
| Moisture resistance DCR change |  | -15 |  | 15 | % | 10 cycles (MIL-STD-202 Method 106) | 1 |
| Salt spray DCR change |  | -10 |  | 10 | % | 48 hour exposure, 5 % salt solution (MIL-STD-202 Method 101) | 1 |
| Mechanical vibration DCR change |  | -10 |  | 10 | % | 0.4 inch D.A. or 30 G between 5-3000 Hz (MIL-STD-202 Method 204) | 1 |
| Mechanical shock DCR change |  | -10 |  | 10 | % | 1500 G, 0.5 ms, half-sine shocks (MIL-STD-202 Method 213) | 1 |
| Thermal shock DCR change |  | -10 |  | 10 | % | 100 cycles between -65 °C and +125 °C (MIL-STD-202 Method 107) | 1 |
| Life voltage drop change |  | -20 |  | 20 | % | 80 % rated current (75 % for < 1 A fuses) for 2000 hours at ambient temperature between +20 °C and +30 °C | 1 |
| Storage temperature |  | 5 |  | 35 | °C | Storage conditions | 2 |
| Storage humidity |  | 40 |  | 75 | % | Storage conditions | 2 |
| Peak package body temperature (wave soldering, Pb-free) | Tp |  |  | 260 | °C | Recommended wave soldering profile, Pb-free assembly; tolerance is supplier minimum and user maximum | 3 |
| Resistance | R |  | 0.0012 |  | Ω | Resistance measured with ≤10 % rated current at 25 °C ambient | 1 |
| Rated current |  |  | 30 |  | A |  | 1 |
| Rated voltage |  |  | 35 |  | V | DC rated voltage for SF-1206HV30M-2; a second line on the same row prints DC 26 V with 300 A interrupting rating | 1 |
| Interrupting rating |  |  | 200 |  | A | DC 35 V | 1 |
| Interrupting rating |  |  | 300 |  | A | DC 26 V | 1 |
| Typical melting I2t | I2t |  | 180 |  | A2s | Melting I2t calculated at 1000 % of current rating | 1 |

## CAD (KiCad official)

- Symbol: `SF-1206HV30M-2`
- Footprint: `Fuse:Fuse_1206_3216Metric`
- 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files: `sf-1206hv30m-2-etched.step` / `sf-1206hv30m-2-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sf-1206hv30m-2.step` / `sf-1206hv30m-2.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [BOURNS datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588920451150057472) (6 pp, sha256 `e9e4f4481ddd73c5`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sf-1206hv30m-2-datasheet.pdf)