component

SESDONCAN1LT3G

Public Made by Adom

by adom

onsemi ESD Protection Devices, SOT-23-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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SESDONCAN1LT3G

onsemi · ESD Protection Devices · SOT-23-3

SESDONCAN1LT3G from onsemi, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CATHODE passive Package Style 27 designates this pin as CATHODE; the datasheet states no other function or limit for it.
2 CATHODE passive Package Style 27 designates this pin as CATHODE; the datasheet states no other function or limit for it.
3 CATHODE passive Package Style 27 designates this pin as CATHODE; the datasheet states no other function or limit for it.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23-3
Category TVS/Fuse/Board Level Protection
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Working Voltage VRWM 24 V 2
Breakdown Voltage VBR 26.2 32 V IT = 1 mA (Note 3) 2
Reverse Leakage Current IR 15 100 nA VRWM = 24 V 2
Clamping Voltage VC 33.4 36.6 V IPP = 1 A (8 x 20 s Waveform) (Note 4) 2
Clamping Voltage VC 44 50 V IPP = 3 A (8 x 20 s Waveform) (Note 4) 2
Maximum Peak Pulse Current IPP 3 A 8 x 20 s Waveform (Note 4) 2
Capacitance CJ 10 pF VR = 0 V, f = 1 MHz (Line to GND) 2
Diode Capacitance Matching C 0.26 2 % VR = 0 V, 5 MHz (Note 5) 2
Peak Power Dissipation PPK 200 W 8 x 20s Double Exponential Waveform (Note 1) 2
Operating Junction Temperature Range TJ -55 150 °C 2
Storage Temperature Range TJ -55 150 °C 2
Lead Solder Temperature TL 260 °C 10 s 2
ESD Human Body Model (HBM) 8 kV 2
ESD Machine Model (MM) 400 V 2
ESD IEC 61000-4-2 Specification (Contact) 23 kV IEC 61000-4-2 Specification (Contact) 2

CAD (KiCad official)

  • Symbol: SESDONCAN1LT3G
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: sesdoncan1lt3g-etched.step / sesdoncan1lt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sesdoncan1lt3g.step / sesdoncan1lt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (6 pp, sha256 b389719ffdd51186, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF