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Ray Publish 0.1.0 d4580ff 17d ago

SE30P12

SINO IC · MOSFETs · SOP-8

SE30P12 from SINO IC, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source of the P-channel MOSFET; VDS rating is -30V and continuous drain current is -11A.
2 S passive Source of the P-channel MOSFET, tied with the other source pins; VGS rating is ±20V.
3 S passive Source of the P-channel MOSFET, tied with the other source pins.
4 G input Gate of the P-channel MOSFET; VGS maximum ±20V, threshold -1 to -3V at ID=-250µA.
5 D passive Drain of the P-channel MOSFET; VDS = -30V, pulsed drain current -50A.
6 D passive Drain of the P-channel MOSFET, tied with the other drain pins.
7 D passive Drain of the P-channel MOSFET, tied with the other drain pins.
8 D passive Drain of the P-channel MOSFET, tied with the other drain pins.

Key specifications

Parameter Value
Manufacturer SINO IC
Package SOP-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -30 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current, Continuous ID -11 A Continuous 1
Drain Current, Pulsed ID -50 A Pulsed 1
Total Power Dissipation PD 2 W @TA=25℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Drain-Source Breakdown Voltage BVDSS -30 -33 V ID=-250μA, VGS=0 2
Drain to Source Leakage Current IDSS -5 μA VDS= -24V, VGS=0V 2
Gate-Body Leakage Current IGSS 100 nA VGS= 20V 2
Gate Threshold Voltage VGS(th) -1 -1.5 -3 V VDS=VGS, ID=-250μA 2
Static Drain-Source On-Resistance RDS(ON) 11.5 15 mΩ VGS=-10V, ID=-10A 2
Static Drain-Source On-Resistance RDS(ON) 18 25 mΩ VGS=-4.5V, ID=-7A 2
Junction to Ambient (t≦10s) RθJA 26 40 ℃/W t≦10s 2

CAD (KiCad official)

  • Symbol: SE30P12
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: se30p12-etched.step / se30p12-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); se30p12.step / se30p12.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SINO IC datasheet (5 pp, sha256 4e4c312c36313f7f, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF