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SE2622L-R

Skyworks Solutions · RF Amplifiers · QFN-16(3x3)

SE2622L-R from Skyworks Solutions, in a QFN-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RF_IN input Power amplifier RF input that requires a DC block.
2 EN input Digital enable pin that powers the IC up and down; logic high minimum is 1.3 VCC, logic low maximum is 0.5 V, and the absolute maximum on VEN is 3.6 V.
3 GND power_in Ground connection.
4 N/U unconnected Not used; no connection is specified for this pin.
5 GND power_in Ground connection.
6 GND power_in Ground connection.
7 DET output Analog power detector output; measured detector voltage is 1.04 V at POUT = +23 dBm and 0.33 V with no RF.
8 N/U unconnected Not used; no connection is specified for this pin.
9 GND power_in Ground connection.
10 N/U unconnected Not used; no connection is specified for this pin.
11 RF_OUT/VCC power_in Power amplifier RF output that also serves as the final-stage collector supply, which must be between 3.0 V and 3.6 V.
12 GND power_in Ground connection.
13 N/U unconnected Not used; no connection is specified for this pin.
14 N/C unconnected No connect.
15 VCC power_in Collector supply for stages 1 and 2, which must be between 3.0 V and 3.6 V.
16 GND power_in Ground connection.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Skyworks Solutions
Package QFN-16(3x3)
Category RF And Wireless
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage on pins VCC VCC -0.3 4 V 2
Power amplifier enable VEN -0.3 3.6 V 2
RF input power RFIN 10 dBm RF_OUT terminated into 50 match 2
Storage temperature range TSTG -40 150 °C 2
Supply voltage VCC 3 3.6 V 2
Supply voltage on pins VCC3 VCC3 3 3.6 V 2
Ambient temperature TA -40 85 °C 2
Logic low voltage VENL 0 0.5 V 3
Input current logic low voltage IENL 1 µA 3
Supply current IOFF IOFF 2 10 µA VEN = 0 V, No RF 3
Frequency range f 2400 2500 MHz 3
Output 1dB compression point P1dB 24.5 27 dBm No modulation 3
Input return loss S11 10 12 dB 3
Small signal gain S21 26 31 34 dB PIN = 25 dBm 3
Harmonic 2f 2f -50 dBm/MHz POUT = +23 dBm, CW 3
Harmonic 3f 3f -50 dBm/MHz POUT = +23 dBm, CW 3
Stability (non-harmonically related outputs) STAB 50 dBc/100 kHz POUT = +23 dBm, 54 Mbps OFDM signal, 64 QAM, VSWR = 6:1, all phases 3
POUT detect range PDR 0 dBm 4
Supply current (Sum of Vcc0, Vcc, Vcc3) 802.11b Icc-802.11b 250 mA POUT = +23 dBm, 11 Mbps CCK signal, BT = 0.45, VCC = VCC3 = 3.3 V 3
Supply current (Sum of Vcc, Vcc3) 802.11g Icc-802.11g 175 mA Pout = +19 dBm, 54 Mbps OFDM signal, Vcc = Vcc3 = 3.3 V 3
Supply current (Sum of Vcc, Vcc3) quiescent ICQ 125 mA No RF 3
Input current logic high voltage IENH 300 µA 3
Enable pin input impedance ZEN 10 kΩ Passive pull down 3
Output power (OFDM 256 QAM HT40 35 dB EVM) POUT 18 dBm OFDM, 256 QAM, HT40, 35 dB EVM 3
Output power (OFDM 256 QAM HT20 35 dB EVM) POUT 19 dBm OFDM, 256 QAM, HT20, 35 dB EVM 3
Output power (OFDM 256 QAM HT40 38 dB EVM) POUT 16 dBm OFDM, 256 QAM, HT40, 38 dB EVM 3
Output power (OFDM 64 QAM HT20 30 dB EVM) POUT 20 dBm OFDM, 64 QAM, HT20, 30 dB EVM 3
Output power (CCK signal, Mask) POUT 23 dBm CCK signal, BT = 0.045, Mask 3
Output power (802.11n HT20 all data rates, Mask) POUT 23 dBm 802.11n, HT20, all data rates, Mask 3
Output power (802.11n HT40 all data rates, Mask) POUT 22 dBm 802.11n, HT40, all data rates, Mask 3
Gain variation over band S21 1 dB PIN = 25 dBm, f = 2400 to 2500 MHz 3
Rise and fall time tR, tF 0.5 µs 3
Detector voltage at POUT +23 dBm VDET 1.04 V POUT = +23 dBm 4
Detector voltage at POUT +21 dBm VDET 0.87 V POUT = +21 dBm 4
Detector voltage with no RF VDET 0.33 V POUT = No RF 4
Output impedance PDZOUT 2.3 kΩ 4
DC load impedance PDZLOAD 10 kΩ 4

CAD (KiCad official)

  • Symbol: SE2622L-R
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: QFN-16(3x3) (KiCad packages3D, STEP)
  • 3D model files: se2622l-r-etched.step / se2622l-r-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); se2622l-r.step / se2622l-r.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Skyworks Solutions datasheet (9 pp, sha256 ead88bf295a61dd3, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF