# SD560BP

**SMC(Sangdest Microelectronicstronic (Nanjing))** · Diodes - General Purpose · SMB(DO-214AA)

SD560BP from SMC(Sangdest Microelectronicstronic (Nanjing)), in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | SMC(Sangdest Microelectronicstronic (Nanjing)) |
| Package | SMB(DO-214AA) |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Peak Repetitive Reverse Voltage | VRRM |  |  | 600 | V |  | 1 |
| Maximum DC Blocking Voltage | VDC |  |  | 600 | V |  | 1 |
| Maximum RMS Voltage | VRMS |  |  | 420 | V |  | 1 |
| Maximum Average Forward Rectified Current | I(AV) |  |  | 5 | A | 0.375"(9.5mm) lead length, TA = 75°C | 1 |
| Non-Repetitive Peak Forward Surge Current | IFSM |  |  | 200 | A | 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) | 1 |
| I²t Rating for fusing | I²t |  |  | 166 | A²S | t < 8.3ms | 1 |
| Maximum Instantaneous Forward Voltage | VF |  |  | 1.2 | V | IF = 5.0A | 1 |
| Maximum DC Reverse Current | IR |  |  | 9 | uA | At rated DC blocking voltage, TA = 25°C | 1 |
| Maximum DC Reverse Current | IR |  |  | 170 | uA | At rated DC blocking voltage, TA = 100°C | 1 |
| Operating Storage Temperature Range | TSTG | -65 |  | 175 | °C |  | 1 |
| Operating Junction Temperature | TJ | -65 |  | 175 | °C |  | 1 |
| Typical Junction Capacitance | Cj |  | 50 |  | pF | 1MHz, applied reverse voltage 4.0V D.C. | 1 |
| Typical Thermal Resistance | RJA |  | 20 |  | °C/W | Junction to ambient, 0.375"(9.5mm) lead length, P.C.B. mounted | 1 |

## CAD (KiCad official)

- Symbol: `SD560BP`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
- 3D model files: `sd560bp-etched.step` / `sd560bp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sd560bp.step` / `sd560bp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [SMC(Sangdest Microelectronicstronic (Nanjing)) datasheet](docs/sd560bp-datasheet.pdf) (4 pp, sha256 `dd9b67c6dd53d254`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sd560bp-datasheet.pdf)