component
SD12T1G
Public Made by Adomby adom
onsemi ESD And Surge Protection (TVS/ESD), SOD-323. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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SD12T1G
onsemi · ESD And Surge Protection (TVS/ESD) · SOD-323
SD12T1G from onsemi, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CATHODE | passive | Cathode of the unidirectional ESD protection diode (marked by polarity band); SD12T1G has VRWM 12 V, VBR 13.3 to 15.75 V at 1.0 mA. |
| 2 | ANODE | passive | Anode of the unidirectional ESD protection diode; typically connected to ground, and the device meets IEC61000-4-2 Level 4 (15 kV air, 8 kV contact). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | VBR | 13.3 | 15.75 | V | IT = 1.0 mA | 2 | |
| Working Peak Reverse Voltage | VRWM | 12 | V | 2 | |||
| Maximum Reverse Leakage Current | IR | 1 | A | @ VRWM | 2 | ||
| Clamping Voltage | VC | 19 | V | IPP = 5 A, 8 × 20 s pulse waveform | 2 | ||
| Maximum Reverse Peak Pulse Current | IPP | 15 | A | 8 × 20 s pulse waveform | 2 | ||
| Clamping Voltage @ Max IPP | VC | 25 | V | @ Max IPP, 8 × 20 s pulse waveform | 2 | ||
| Capacitance | C | 150 | pF | VR = 0 V, f = 1.0 MHz | 2 | ||
| Peak Power Dissipation | Ppk | 350 | Watts | @ 20 s, TL ≤ 25°C | 2 | ||
| IEC 61000-4-2 ESD Air | -15 | 15 | kV | Air | 2 | ||
| IEC 61000-4-2 ESD Contact | -8 | 8 | kV | Contact | 2 | ||
| IEC 61000-4-4 EFT | 40 | A | 2 | ||||
| ESD Voltage (HBM) | VPP | 30 | kV | Human Body Model waveform per IEC 61000-4-2 | 2 | ||
| Total Power Dissipation on FR-4 Board | PD | 300 | mW | TA = 25°C, FR-4 board, mounting pad 1 cm2 | 2 | ||
| Power Derating above 25°C | 2.4 | mW/°C | Derate above 25°C | 2 | |||
| Thermal Resistance, Junction-to-Ambient | RJA | 416 | °C/W | 2 | |||
| Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 2 | ||
| Lead Solder Temperature | TL | 260 | °C | Maximum, 10 second duration | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any | 1 |
CAD (KiCad official)
- Symbol:
SD12T1G - Footprint:
Diode_SMD:D_SOD-323 - 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files:
sd12t1g-etched.step/sd12t1g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);sd12t1g.step/sd12t1g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (4 pp, sha256
195d4eac64ad90dd, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# SD12T1G
**onsemi** · ESD And Surge Protection (TVS/ESD) · SOD-323
SD12T1G from onsemi, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CATHODE | passive | Cathode of the unidirectional ESD protection diode (marked by polarity band); SD12T1G has VRWM 12 V, VBR 13.3 to 15.75 V at 1.0 mA. |
| 2 | ANODE | passive | Anode of the unidirectional ESD protection diode; typically connected to ground, and the device meets IEC61000-4-2 Level 4 (15 kV air, 8 kV contact). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | VBR | 13.3 | | 15.75 | V | IT = 1.0 mA | 2 |
| Working Peak Reverse Voltage | VRWM | | | 12 | V | | 2 |
| Maximum Reverse Leakage Current | IR | | | 1 | A | @ VRWM | 2 |
| Clamping Voltage | VC | | | 19 | V | IPP = 5 A, 8 × 20 s pulse waveform | 2 |
| Maximum Reverse Peak Pulse Current | IPP | | | 15 | A | 8 × 20 s pulse waveform | 2 |
| Clamping Voltage @ Max IPP | VC | | | 25 | V | @ Max IPP, 8 × 20 s pulse waveform | 2 |
| Capacitance | C | | | 150 | pF | VR = 0 V, f = 1.0 MHz | 2 |
| Peak Power Dissipation | Ppk | | | 350 | Watts | @ 20 s, TL ≤ 25°C | 2 |
| IEC 61000-4-2 ESD Air | | -15 | | 15 | kV | Air | 2 |
| IEC 61000-4-2 ESD Contact | | -8 | | 8 | kV | Contact | 2 |
| IEC 61000-4-4 EFT | | | | 40 | A | | 2 |
| ESD Voltage (HBM) | VPP | | | 30 | kV | Human Body Model waveform per IEC 61000-4-2 | 2 |
| Total Power Dissipation on FR-4 Board | PD | | | 300 | mW | TA = 25°C, FR-4 board, mounting pad 1 cm2 | 2 |
| Power Derating above 25°C | | | 2.4 | | mW/°C | Derate above 25°C | 2 |
| Thermal Resistance, Junction-to-Ambient | RJA | | 416 | | °C/W | | 2 |
| Junction and Storage Temperature Range | TJ, Tstg | -55 | | 150 | °C | | 2 |
| Lead Solder Temperature | TL | | | 260 | °C | Maximum, 10 second duration | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any | 1 |
## CAD (KiCad official)
- Symbol: `SD12T1G`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `sd12t1g-etched.step` / `sd12t1g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sd12t1g.step` / `sd12t1g.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [onsemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588880527331483648) (4 pp, sha256 `195d4eac64ad90dd`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/sd12t1g-datasheet.pdf)