Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

SD10U45L

LGE · Schottky Barrier Diodes (SBD) · TO-277

SD10U45L from LGE, in a TO-277. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive Anode (left pin), connected internally to the right pin; the device is rated 10A average forward current and 45V repetitive peak reverse voltage.
2 A passive Anode (right pin), connected internally to the left pin; the device is rated 10A average forward current and 45V repetitive peak reverse voltage.
3 K passive Cathode, the bottomside heat sink of the TO-277 package, which is the cathode pad used for thermal dissipation (Rth(JA) 31 °C/W on the specified PCB).

Key specifications

Parameter Value
Manufacturer LGE
Package TO-277
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward Voltage VF 0.45 V IF = 10A 2
Forward Voltage VF 0.42 0.45 V IF = 10A 2
Reverse Breakdown Voltage VBR 45 V IR = 0.5mA 2
Reverse Leakage Current IR 0.2 mA VR = 45V 2
Reverse Leakage Current IR 10 mA VR = 45V, @100℃ 2
Repetitive Peak Reverse Voltage VRRM 45 V Tamb=25°C 1
Average Forward Current IF(AV) 10 A Tamb=25°C 1
Peak Forward Surge Current IFSM 250 A 8.3ms single half sine-wave 1
Junction and Storage Temperature TJ & TSTG -40 150 °C Tamb=25°C 1
Forward Voltage VF 0.18 V IF = 0.01A 2
Forward Voltage VF 0.27 V IF = 0.5A 2
Forward Voltage VF 0.31 V IF = 2A 2
Forward Voltage VF 0.4 V IF = 8A 2
Thermal Resistance Rth(JA) 31 ℃/W Polymide PCB, 2oz. copper, cathode pad 18.8x14.4mm, anode pad 5.6x14.4mm 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Terminal: Matte tin plated, solderable per MIL-STD-750, Method 2026 1

CAD (KiCad official)

  • Symbol: SD10U45L
  • Footprint: Package_TO_SOT_SMD:TO-277A
  • 3D model: TO-277 (KiCad packages3D, STEP)
  • 3D model files: sd10u45l-etched.step / sd10u45l-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sd10u45l.step / sd10u45l.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LGE datasheet (3 pp, sha256 35084bd4d4ac906f, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF