# SD10U100SL

**LGE** · Schottky Barrier Diodes (SBD) · TO-277

SD10U100SL from LGE, in a TO-277. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A | passive | Anode: one of two small pads tied together on the left side of the pin-configuration diagram, on the anode side of the 10A/100V Schottky diode. |
| 2 | A | passive | Anode: second small pad tied internally to the other anode pad in the pin-configuration diagram, on the anode side of the 10A/100V Schottky diode. |
| 3 | K | passive | Cathode: single larger pad (the top tab in the outline drawing) on the cathode side of the diode, rated for 100V peak repetitive reverse voltage. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | LGE |
| Package | TO-277 |
| Category | Diodes |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Average Forward Current | IF(AV) |  |  | 10 | A |  | 2 |
| Peak Forward Surge Current | IFSM |  |  | 200 | A | 8.3ms single half sine-wave | 2 |
| Junction and Storage Temperature | TJ & TSTG | -55 |  | 150 | °C |  | 2 |
| Peak Repetitive Reverse Voltage | VRRM |  |  | 100 | V |  | 2 |
| Working Peak Reverse Voltage | VRWM |  |  | 100 | V |  | 2 |
| RMS Rectified Voltage | VR(RMS) |  |  | 70 | V |  | 2 |
| Typical Thermal Resistance Junction to Ambient | RθJA |  | 80 |  | ℃/W |  | 2 |
| Typical Thermal Resistance Junction to Lead | RθJL |  | 15 |  | ℃/W |  | 2 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | Terminal: Matte tin plated, solderable per MIL-STD-750, Method 2026 | 1 |

## CAD (KiCad official)

- Symbol: `SD10U100SL`
- Footprint: `Package_TO_SOT_SMD:TO-277A`
- 3D model: TO-277 (KiCad packages3D, STEP)
- 3D model files: `sd10u100sl-etched.step` / `sd10u100sl-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sd10u100sl.step` / `sd10u100sl.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [LGE datasheet](docs/sd10u100sl-datasheet.pdf) (4 pp, sha256 `72e1c51c98c6366f`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sd10u100sl-datasheet.pdf)