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Contents

README

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SCT2450QSTER

SCT · DC-DC Converters · ESOP-8

SCT2450QSTER from SCT, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT passive Power supply bias for the high-side power MOSFET gate driver. Connect a 0.1 µF bootstrap capacitor from BOOT to SW. The bootstrap capacitor is charged when the low-side MOSFET is on or SW is low. Absolute max 44 V (BOOT-SW max 6 V).
2 VIN power_in Input supply voltage, 3.8 V to 36 V operating (absolute max 38 V, 42 V transient 300 ms). Connect a local high-frequency bypass capacitor from VIN to GND as short as possible.
3 EN input Enable pin to the regulator with internal pull-up current source (1.5 µA typ at 1 V). Pull below 1.1 V to disable the converter; float or tie to VIN to enable. A resistor divider from VIN to GND to EN can program the input UVLO threshold. Enable high threshold 1.18 V typ.
4 RT/CLK bidirectional Frequency set / external clock input. Connect a resistor from RT/CLK to GND to set the internal oscillator frequency (100 kHz to 2.2 MHz). Alternatively drive with an external clock (100 kHz-2.2 MHz); the internal PLL synchronizes to the external clock and reverts to resistor-set frequency if clock edges stop.
5 FB input Inverting input of the trans-conductance error amplifier. Tap an external resistor divider from VOUT to GND to set the output voltage; the device regulates FB to the internal reference of 0.8 V (±1%) typical.
6 COMP output Error amplifier output. Connect a frequency loop compensation network (typically series R + C, optional parallel C) from COMP to GND. Clamp voltages: high 3 V, low 0.4 V.
7 GND power_in Device ground return.
8 SW power_out Regulator switching node. Connect SW to the external power inductor. This is the switch node between the integrated high-side (48 mΩ) and low-side (23 mΩ) power MOSFETs. Absolute max range -1 V to 38 V.
9 Thermal Pad power_in Exposed thermal pad on the ESOP-8 package. Heat dissipation path of the die; electrically connected to GND. Must be soldered to the PCB ground plane for proper operation and optimized thermal performance (θJA ≈ 42 °C/W, θJC ≈ 45.8 °C/W).

Key specifications

Parameter Value
Manufacturer SCT
Package ESOP-8
Category PMIC
Pins 9

Ordering variants

Same part, different packaging or reel option.

  • SCT2450QSTER

CAD (KiCad official)

  • Symbol: SCT2450QSTER
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)
  • 3D model files: sct2450qster-etched.step / sct2450qster-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sct2450qster.step / sct2450qster.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SCT datasheet (22 pp, sha256 74bb039979bfaa07, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF