Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

SC18IM704PWJ

NXP Semicon · Interface - Specialized · TSSOP-16

SC18IM704PWJ from NXP Semicon, in a TSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SDA bidirectional I2C-bus data pin.
2 SCL output I2C-bus clock output.
3 GPIO6 bidirectional Programmable I/O pin which must be pulled HIGH with a resistor and must not be held LOW at power on or reset.
4 RESET input Hardware reset input.
5 GPIO7 bidirectional Programmable I/O pin.
6 GPIO3 bidirectional Programmable I/O pin.
7 GPIO2 bidirectional Programmable I/O pin.
8 GPIO4 bidirectional Programmable I/O pin.
9 GPIO0 bidirectional Programmable I/O pin.
10 RX input RS-232 receive input and wake-up; the command 0x5A 0xA5 puts the device into Deep Power-down mode, which it exits when RX is driven LOW.
11 TX output RS-232 transmit output.
12 VDD power_in Power supply.
13 VSS power_in Ground.
14 GPIO5 bidirectional Programmable I/O pin.
15 VREFP input Connect to VDD.
16 GPIO1 bidirectional Programmable I/O pin.

Key specifications

Parameter Value
Manufacturer NXP Semicon
Package TSSOP-16
Category Communication Interface Chip/UART/485/232
Pins 16

CAD (KiCad official)

  • Symbol: SC18IM704PWJ
  • Footprint: Package_SO:TSSOP-16_4.4x5mm_P0.65mm
  • 3D model: TSSOP-16 (KiCad packages3D, STEP)
  • 3D model files: sc18im704pwj-etched.step / sc18im704pwj-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sc18im704pwj.step / sc18im704pwj.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NXP Semicon datasheet (28 pp, sha256 6063b8045a9419c3, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF