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Contents

README

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SC16IS750

NXP · UART bridge · TSSOP-24

Adds a full UART to a host that talks I2C or SPI, so a microcontroller short on serial ports gains a hardware UART with a 64-byte transmit and receive FIFO. The bridge handles baud rates to 5 Mbps, full modem control lines, and hardware or software flow control, offloading the timing from the host. Eight of its pins double as GPIO, and an IRQ line signals events. A pin selects I2C or SPI. A common way to add a reliable UART to an I2C or SPI system.

Pinout

Pin Name Type Function
1 CTS input UART clear-to-send input (active LOW). A logic 0 indicates the modem/DTE is ready to accept transmit data. Status is readable via MSR[4]; only affects transmit when auto-CTS is enabled in EFR[7].
2 TX output UART transmitter serial output. Disabled and internally looped back to RX during local Loopback mode.
3 RX input UART receiver serial input. Disabled in local Loopback mode where TX is internally routed to RX.
4 RESET input Device hardware reset, active LOW. See Section 7.4.1 for reset behavior.
5 XTAL1 input Crystal input or external clock input. A crystal can be tied between XTAL1 and XTAL2 to form the internal oscillator, or an external clock can drive this pin directly.
6 XTAL2 output Crystal oscillator output; used together with XTAL1 when a crystal is fitted.
7 VDD power_in Power supply, 2.5 V or 3.3 V nominal.
8 I2C/SPI input Interface select. Tie HIGH for I2C-bus target mode, LOW for SPI target mode. Determines the function of pins 9-13.
9 CS/A0 input In SPI mode: SPI chip-select input (Schmitt-trigger, active LOW). In I2C mode: device-address select bit A0 (combines with A1 to program the 7-bit target address; see Table 32).
10 SI/A1 input In SPI mode: SPI serial data input (MOSI). In I2C mode: device-address select bit A1 (combines with A0 to program the target address).
11 SO tri_state SPI serial data output (MISO), 3-stateable. In I2C mode this pin is undefined and must be left unconnected.
12 SCL/SCLK input Serial clock input. Acts as I2C-bus SCL when I2C is selected, or SPI SCLK when SPI is selected (SPI Mode 0, up to 4 Mbit/s on SC16IS750).
13 SDA bidirectional I2C-bus data line, open-drain, when I2C interface is selected. If SPI is selected this pin is undefined and must be tied to VSS.
14 IRQ output Interrupt output, open-drain, active LOW. Requires an external pull-up to VDD (~1 kΩ at 3.3 V, ~1.5 kΩ at 2.5 V). Asserts on enabled sources in the IER (line status, RX data available, TX empty, modem status, GPIO change).
15 GPIO0 bidirectional Programmable I/O pin with active pull-up (see Table 36). Direction, level, and interrupt behavior are set via the IODir/IOState/IOIntEna registers.
16 GPIO1 bidirectional Programmable I/O pin with active pull-up (see Table 36).
17 GPIO2 bidirectional Programmable I/O pin with active pull-up (see Table 36).
18 GPIO3 bidirectional Programmable I/O pin with active pull-up (see Table 36).
19 VSS power_in Device ground reference.
20 GPIO4/DSR bidirectional Programmable I/O pin, or modem DSR (Data Set Ready) input. Function is selected by IOControl register bit 1; active pull-up on input.
21 GPIO5/DTR bidirectional Programmable I/O pin, or modem DTR (Data Terminal Ready) output. Selected via IOControl bit 1.
22 GPIO6/CD bidirectional Programmable I/O pin, or modem CD (Carrier Detect) input. Selected via IOControl bit 1.
23 GPIO7/RI bidirectional Programmable I/O pin, or modem RI (Ring Indicator) input. Selected via IOControl bit 1.
24 RTS output UART request-to-send output, active LOW. Set by MCR[1] (or automatically driven when auto-RTS is enabled via EFR[6]); can also serve as the RS-485 driver direction-control signal.

Key specifications

Parameter Value
Type I2C/SPI-to-UART bridge
Channels 1 UART
FIFO 64 bytes (TX and RX)
Max baud 5 Mbps
GPIO 8 (shared)
Host interface I2C or SPI (pin-selected)
Supply 2.5-3.6 V
Package TSSOP-24

Ordering variants

Same part, different packaging or reel option.

  • SC16IS750IPW (TSSOP-24)
  • SC16IS750IBS (HVQFN-24)

CAD (KiCad official)

  • Symbol: Interface_UART:SC16IS750xPW (KiCad official)
  • Footprint: Package_SO:TSSOP-24_4.4x7.8mm_P0.65mm
  • 3D model: TSSOP-24 (KiCad packages3D, STEP)
  • 3D model files: sc16is750-etched.step / sc16is750-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sc16is750.step / sc16is750.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NXP datasheet (61 pp, sha256 805796f4b2fd33e6, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF