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Contents

README

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SBR2U150SA-13

Diodes Incorporated · Super Barrier Rectifiers (SBR) · SMA(DO-214AC)

SBR2U150SA-13 from Diodes Incorporated, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Breakdown Voltage V(BR)R 150 V IR = 100µA 2
Forward Voltage Drop VF 0.8 V IF = 2.0A, TJ = +25°C 2
Forward Voltage Drop VF 0.65 V IF = 2.0A, TJ = +125°C 2
Leakage Current IR 75 µA VR = 150V, TJ = +25°C 2
Leakage Current IR 10 mA VR = 150V, TJ = +125°C 2
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM, VRWM, VRM 150 V @TA = +25°C, unless otherwise specified 2
Average Rectified Output Current IO 2 A See Fig. 1 2
Non-Repetitive Peak Forward Surge Current IFSM 42 A 8.3ms single half sine wave superimposed on rated load 2
Maximum Voltage Rate of Change (Rated VR) dv/dt 10000 V/µs Rated VR 2
Thermal Resistance Junction to Soldering (Note 5) RθJS 3 °C/W Note 5: theoretical RθJS from top center of die to PCB cathode tab solder junction 2
Thermal Resistance Junction to Ambient (Note 6) RθJA 119 °C/W Note 6: FR-4 PCB, 2oz. copper, minimum recommended pad layout; TA = +25°C 2
Thermal Resistance Junction to Ambient (Note 7) RθJA 88 °C/W Note 7: Polymide PCB, 2oz. copper, minimum recommended pad layout 2
Operating and Storage Temperature Range TJ, TSTG -65 175 °C 2

CAD (KiCad official)

  • Symbol: SBR2U150SA-13
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: sbr2u150sa-13-etched.step / sbr2u150sa-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sbr2u150sa-13.step / sbr2u150sa-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 f685eb1c5142767a, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF