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Contents

README

markdown

SBR1A40S1-7

Diodes Incorporated · Super Barrier Rectifier (SBR) · SOD-123

SBR1A40S1-7 from Diodes Incorporated, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOD-123
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM, VRWM, VRM 40 V TA = +25°C 2
Average Rectified Output Current IO 1 A TC = +65°C 2
Non-Repetitive Peak Forward Surge Current IFSM 20 A 8.3ms Single Half Sine-Wave Superimposed on Rated Load 2
Power Dissipation PD 320 mW Note 6 2
Operating and Storage Temperature Range TJ, TSTG -65 150 °C 2
Forward Voltage Drop VF 0.52 V IF = 1A, TJ = +25°C 2
Forward Voltage Drop VF 0.44 0.5 V IF = 1A, TJ = +125°C 2
Leakage Current IR 18 200 µA VR = 40V, TJ = +25°C 2
Leakage Current IR 4 mA VR = 40V, TJ = +100°C 2
Thermal Resistance Junction to Ambient (Note 5) RθJA 473 °C/W Note 5: FR-4 PCB, 2 oz. copper, minimum recommended pad layout 2
Thermal Resistance Junction to Ambient (Note 6) RθJA 407 °C/W Note 6: FR-4, 1" x 1", 2oz copper, single-sided 2
Thermal Resistance Junction to Case (Note 5) RθJC 90 °C/W Note 5: FR-4 PCB, 2 oz. copper, minimum recommended pad layout 2
Thermal Resistance Junction to Case (Note 6) RθJC 80 °C/W Note 6: FR-4, 1" x 1", 2oz copper, single-sided 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Leads: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: SBR1A40S1-7
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123 (KiCad packages3D, STEP)
  • 3D model files: sbr1a40s1-7-etched.step / sbr1a40s1-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sbr1a40s1-7.step / sbr1a40s1-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 360366bb3c6a3017, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF