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Contents

README

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SBAT54CLT1G

onsemi · Schottky Barrier Diodes (SBD) · SOT-23

SBAT54CLT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ANODE passive Anode of the first Schottky diode (diode 1) in the dual common-cathode pair; each diode is rated for 30 V reverse voltage and 200 mA forward current.
2 ANODE passive Anode of the second Schottky diode (diode 2) in the dual common-cathode pair; each diode is rated for 30 V reverse voltage and 200 mA forward current.
3 CATHODE passive Common cathode of both Schottky diodes, with 30 V reverse voltage rating per diode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Breakdown Voltage V(BR)R 30 V IR = 10 µA 2
Total Capacitance CT 7.6 10 pF VR = 1.0 V, f = 1.0 MHz 2
Reverse Leakage IR 0.5 2 µA VR = 25 V 2
Forward Voltage VF 0.22 0.24 V IF = 0.1 mA 2
Forward Voltage VF 0.29 0.32 V IF = 1.0 mA 2
Forward Voltage VF 0.35 0.4 V IF = 10 mA 2
Forward Voltage VF 0.41 0.5 V IF = 30 mA 2
Forward Voltage VF 0.52 0.8 V IF = 100 mA 2
Reverse Recovery Time trr 5 ns IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc, Figure 1 2
Reverse Voltage VR 30 V TJ = 125°C 1
Forward Power Dissipation PF 225 mW TA = 25°C 1
Power Derating above 25°C PF 1.8 mW/°C Derate above 25°C 1
Forward Current (DC) IF 200 mA TJ = 125°C 1
Non-Repetitive Peak Forward Current IFSM 600 mA tp < 10 msec 1
Repetitive Peak Forward Current IFRM 300 mA Pulse Wave = 1 sec, Duty Cycle = 66% 1
Junction Temperature TJ -55 125 °C 1
Storage Temperature Range Tstg -55 150 °C 1
Thermal Resistance, Junction-to-Ambient RJA 508 °C/W Note 1: FR-4 @ Minimum Pad 1
Thermal Resistance, Junction-to-Ambient RJA 311 °C/W Note 2: FR-4 @ 1.0 x 1.0 inch Pad 1

CAD (KiCad official)

  • Symbol: SBAT54CLT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: sbat54clt1g-etched.step / sbat54clt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); sbat54clt1g.step / sbat54clt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (4 pp, sha256 b6d890f754ceb908, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF