# SBAS40LT1G

**onsemi** · Schottky Diodes · SOT-23

SBAS40LT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ANODE | passive | Schottky diode anode; the device is rated for 40 V reverse voltage and 120 mA forward continuous current. |
| 2 | NC | unconnected | No connection; the datasheet specifies this pin as NO CONNECTION for STYLE 8. |
| 3 | CATHODE | passive | Schottky diode cathode; the device is rated for 40 V reverse voltage and 120 mA forward continuous current. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOT-23 |
| Category | Diodes |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage | V(BR)R | 40 |  |  | V | IR = 10 A (as printed) | 2 |
| Total Capacitance | CT |  |  | 5 | pF | VR = 1.0 V, f = 1.0 MHz | 2 |
| Reverse Leakage | IR |  |  | 1 | Adc | VR = 25 V | 2 |
| Forward Voltage | VF |  |  | 380 | mVdc | IF = 1.0 mAdc | 2 |
| Forward Voltage | VF |  |  | 500 | mVdc | IF = 10 mAdc | 2 |
| Forward Voltage | VF |  |  | 1 | Vdc | IF = 40 mAdc | 2 |
| Reverse Voltage | VR |  |  | 40 | V |  | 1 |
| Forward Power Dissipation | PF |  |  | 225 | mW | @ TA = 25°C | 1 |
| Forward Power Dissipation derating | PF |  |  | 1.8 | mW/°C | Derate above 25°C | 1 |
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 |  | 150 | °C |  | 1 |
| Forward Continuous Current | IF |  |  | 120 | mA |  | 1 |
| Forward Surge Current | IFSM |  |  | 200 | mA | t 1 s (as printed) | 1 |
| Forward Surge Current | IFSM |  |  | 600 | mA | t 10 ms (as printed) | 1 |
| Thermal Resistance, Junction-to-Ambient | RJA |  |  | 508 | °C/W | FR-4 @ minimum pad (Note 1) | 1 |
| Thermal Resistance, Junction-to-Ambient | RJA |  |  | 311 | °C/W | FR-4 @ 1.0 x 1.0 in pad (Note 2) | 1 |

## CAD (KiCad official)

- Symbol: `SBAS40LT1G`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `sbas40lt1g-etched.step` / `sbas40lt1g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `sbas40lt1g.step` / `sbas40lt1g.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [onsemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588893857107365888) (4 pp, sha256 `e3422ecf675c740d`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/sbas40lt1g-datasheet.pdf)