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Contents

README

markdown

S8MC-13

Diodes Incorporated · Diodes - General Purpose · SMC(DO-214AB)

S8MC-13 from Diodes Incorporated, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SMC(DO-214AB)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 1000 V @TA = +25°C; also VRWM, VR 2
RMS Reverse Voltage VR(RMS) 700 V @TA = +25°C 2
Average Rectified Output Current IO 8 A @ TT = +75°C 2
Non-Repetitive Peak Forward Surge Current IFSM 200 A 8.3ms single half sine-wave superimposed on rated load 2
Non-Repetitive Peak Forward Surge Current IFSM 450 A 1.0ms single half sine-wave superimposed on rated load 2
I2t Rating for fusing I2t 166 A2S t < 8.3ms 2
Operating and Storage Temperature Range TJ, TSTG -65 150 °C 2
Minimum Reverse Breakdown Voltage V(BR)R 1000 V @IR = 10μA 2
Maximum Forward Voltage VFM 0.985 V @ IF = 8.0A 2
Peak Reverse Current IRM 10 μA @TA = +25°C 2
Peak Reverse Current IRM 250 μA @TA = +125°C 2
Typical Reverse Recovery Time TRR 2700 ns IF=0.5A, IR=1.0A, IRR=0.25A 2
Typical Total Capacitance CT 45 pF 1.0MHz, applied reverse voltage of 4.0V DC 2
Typical Thermal Resistance, Junction to Terminal RθJT 10 °C/W device mounted on 100.5mm x 102.5mm x 1.7mm Cu plate heatsink 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: S8MC-13
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
  • 3D model files: s8mc-13-etched.step / s8mc-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); s8mc-13.step / s8mc-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (4 pp, sha256 3aeb79c24105a1d6, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF