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Contents

README

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S5JC

Shandong Jingdao Microelectronics · Diodes - General Purpose · SMC(DO-214AB)

S5JC from Shandong Jingdao Microelectronics, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal of the rectifier diode (S5JC: 600 V repetitive peak reverse, 5 A average forward current).
2 Anode passive Anode terminal of the rectifier diode (S5JC: 600 V repetitive peak reverse, 5 A average forward current).

Key specifications

Parameter Value
Manufacturer Shandong Jingdao Microelectronics
Package SMC(DO-214AB)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Repetitive Peak Reverse Voltage VRRM 600 V S5JC column 1
Maximum RMS voltage VRMS 420 V S5JC column 1
Maximum DC Blocking Voltage VDC 600 V S5JC column 1
Maximum Average Forward Rectified Current IF(AV) 5 A Single phase half-wave 60 Hz, resistive or inductive load 1
Peak Forward Surge Current IFSM 120 A 8.3 ms single half sine wave superimposed on rated load 1
Maximum Instantaneous Forward Voltage VF 1 V at 5 A 1
Maximum DC Reverse Current IR 5 μA Ta=25 °C, at rated DC blocking voltage 1
Maximum DC Reverse Current IR 100 μA Ta=125 °C, at rated DC blocking voltage 1
Operating and Storage Temperature Range Tj, Tstg -55 150 °C 1
Typical Junction Capacitance Cj 50 pF Measured at 1 MHz and applied reverse voltage of 4 V D.C 1
Typical Thermal Resistance RθJA 35 °C/W P.C.B. mounted with 2.0" X 2.0" (5 X 5 cm) copper pad areas 1
Typical Thermal Resistance RθJC 13 °C/W P.C.B. mounted with 2.0" X 2.0" (5 X 5 cm) copper pad areas 1

CAD (KiCad official)

  • Symbol: S5JC
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
  • 3D model files: s5jc-etched.step / s5jc-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); s5jc.step / s5jc.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shandong Jingdao Microelectronics datasheet (3 pp, sha256 3e8a0a6c135fac50, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF