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Contents

README

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S3MHV6G

Taiwan Semiconductor(Taiwan Semicon) · Diodes - General Purpose · SMC(DO-214AB)

S3MHV6G from Taiwan Semiconductor(Taiwan Semicon), in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Taiwan Semiconductor(Taiwan Semicon)
Package SMC(DO-214AB)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward voltage per diode VF 1.15 V IF = 3A, TJ = 25°C 2
Reverse current @ rated VR per diode IR 10 µA TJ = 25°C 2
Reverse current @ rated VR per diode IR 250 µA TJ = 125°C 2
Repetitive peak reverse voltage VRRM 1000 V S3M, TA = 25°C 1
Reverse voltage, total rms value VR(RMS) 700 V S3M, TA = 25°C 1
Maximum DC blocking voltage VDC 1000 V S3M, TA = 25°C 1
Forward current IF(AV) 3 A TA = 25°C 1
Surge peak forward current IFSM 100 A 8.3 ms single half sine-wave superimposed on rated load per diode 1
Junction temperature TJ -55 150 °C 1
Storage temperature TSTG -55 150 °C 1
Junction-to-lead thermal resistance per diode RӨJL 13 °C/W 2
Junction-to-ambient thermal resistance per diode RӨJA 47 °C/W 2
Junction capacitance CJ 60 pF 1 MHz, VR=4.0V 2
Reverse recovery time trr 1500 ns IF=0.5A, IR=1.0A, IRR=0.25A 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 2 whisker test 1

CAD (KiCad official)

  • Symbol: S3MHV6G
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
  • 3D model files: s3mhv6g-etched.step / s3mhv6g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); s3mhv6g.step / s3mhv6g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Taiwan Semiconductor(Taiwan Semicon) datasheet (6 pp, sha256 43346bdca49c3dce, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF