component
S3M
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TWGMC Diodes - General Purpose, SMB. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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S3M
TWGMC · Diodes - General Purpose · SMB
S3M from TWGMC, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TWGMC |
| Package | SMB |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage (S3M) | VRRM | 1000 | V | S3M column (1000 V variant) | 1 | ||
| Maximum RMS voltage (S3M) | VRMS | 700 | V | S3M column (1000 V variant) | 1 | ||
| Maximum DC blocking voltage (S3M) | VDC | 1000 | V | S3M column (1000 V variant) | 1 | ||
| Operating junction and storage temperature range | TJ,TSTG | -50 | 150 | C | 1 | ||
| Maximum average forward rectified current | I(AV) | 3 | Amps | at TL=110 C | 1 | ||
| Peak forward surge current | IFSM | 100 | Amps | 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) | 1 | ||
| Maximum instantaneous forward voltage | VF | 1.1 | Volts | at 3.0A | 1 | ||
| Maximum DC reverse current | IR | 5 | µA | TA=25 C, at rated DC blocking voltage | 1 | ||
| Maximum DC reverse current | IR | 100 | µA | TA=100 C, at rated DC blocking voltage | 1 | ||
| Typical junction capacitance | CJ | 60 | pF | Measured at 1MHz and applied reverse voltage of 4.0V D.C. | 1 | ||
| Typical thermal resistance, junction to ambient | RθJA | 50 | C/W | P.C.B. mounted with 0.2x0.2" (5.0x5.0mm) copper pad areas | 1 |
CAD (KiCad official)
- Symbol:
S3M - Footprint:
Diode_SMD:D_SMB - 3D model: SMB (KiCad packages3D, STEP)
- 3D model files:
s3m-etched.step/s3m-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);s3m.step/s3m.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TWGMC datasheet (2 pp, sha256
992648d509e5ed77, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# S3M
**TWGMC** · Diodes - General Purpose · SMB
S3M from TWGMC, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TWGMC |
| Package | SMB |
| Category | Diodes |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage (S3M) | VRRM | | | 1000 | V | S3M column (1000 V variant) | 1 |
| Maximum RMS voltage (S3M) | VRMS | | | 700 | V | S3M column (1000 V variant) | 1 |
| Maximum DC blocking voltage (S3M) | VDC | | | 1000 | V | S3M column (1000 V variant) | 1 |
| Operating junction and storage temperature range | TJ,TSTG | -50 | | 150 | C | | 1 |
| Maximum average forward rectified current | I(AV) | | | 3 | Amps | at TL=110 C | 1 |
| Peak forward surge current | IFSM | | | 100 | Amps | 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) | 1 |
| Maximum instantaneous forward voltage | VF | | | 1.1 | Volts | at 3.0A | 1 |
| Maximum DC reverse current | IR | | | 5 | µA | TA=25 C, at rated DC blocking voltage | 1 |
| Maximum DC reverse current | IR | | | 100 | µA | TA=100 C, at rated DC blocking voltage | 1 |
| Typical junction capacitance | CJ | | 60 | | pF | Measured at 1MHz and applied reverse voltage of 4.0V D.C. | 1 |
| Typical thermal resistance, junction to ambient | RθJA | | 50 | | C/W | P.C.B. mounted with 0.2x0.2" (5.0x5.0mm) copper pad areas | 1 |
## CAD (KiCad official)
- Symbol: `S3M`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMB (KiCad packages3D, STEP)
- 3D model files: `s3m-etched.step` / `s3m-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `s3m.step` / `s3m.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [TWGMC datasheet](docs/s3m-datasheet.pdf) (2 pp, sha256 `992648d509e5ed77`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/s3m-datasheet.pdf)