component

S3AC

Public Made by Adom

by adom

MDD（Microdiode Electronics） Diodes - General Purpose, SMC(DO-214AB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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S3AC

MDD（Microdiode Electronics） · Diodes - General Purpose · SMC(DO-214AB)

S3AC from MDD（Microdiode Electronics）, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer MDD（Microdiode Electronics）
Package SMC(DO-214AB)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum repetitive peak reverse voltage VRRM 50 V 1
Maximum RMS voltage VRMS 35 V 1
Maximum DC blocking voltage VDC 50 V 1
Maximum average forward rectified current I(AV) 3 A 1
Peak forward surge current IFSM 90 A 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) 1
Maximum instantaneous forward voltage VF 1 V at 3.0A 1
Maximum DC reverse current IR 5 μA TA=25℃ at rated DC blocking voltage 1
Maximum DC reverse current IR 100 μA TA=125℃ at rated DC blocking voltage 1
Operating junction and storage temperature range TJ,TSTG -55 150 ℃ 1
Typical thermal resistance junction to ambient RθJA 40 ℃/W P.C.B. mounted with 2.0"x2.0" (5.0x5.0cm) copper pad areas 1
Typical thermal resistance junction to case RθJC 16 ℃/W P.C.B. mounted with 2.0"x2.0" (5.0x5.0cm) copper pad areas 1
Typical junction capacitance CJ 40 pF Measured at 1MHz and applied reverse voltage of 4.0V D.C. 1

CAD (KiCad official)

  • Symbol: S3AC
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
  • 3D model files: s3ac-etched.step / s3ac-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); s3ac.step / s3ac.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MDD（Microdiode Electronics） datasheet (3 pp, sha256 70714220350a977f, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF