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S2BA-13-F

Diodes Incorporated · Diodes - General Purpose · SMA(DO-214AC)

S2BA-13-F from Diodes Incorporated, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode, the terminal marked by the cathode band or cathode notch; the S2B/BA version has 100V peak repetitive reverse voltage and 1.5A average rectified current.
2 A passive Anode, the terminal opposite the cathode band; the S2B/BA version has 100V peak repetitive reverse voltage and 1.5A average rectified current.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 100 V TA = 25°C; S2B/BA column 2
Working Peak Reverse Voltage VRWM 100 V TA = 25°C; S2B/BA column 2
DC Blocking Voltage VR 100 V TA = 25°C; S2B/BA column 2
RMS Reverse Voltage VR(RMS) 70 V TA = 25°C; S2B/BA column 2
Average Rectified Output Current I(AV) 1.5 A TT = 100°C 2
Non-Repetitive Peak Forward Surge Current IFSM 50 A 8.3ms single half sine-wave superimposed on rated load 2
Operating and Storage Temperature Range TJ, TSTG -65 150 °C 2
Forward Voltage VFM 1.15 V IF = 1.5A, TA = 25°C 2
Peak Reverse Current IRM 5 µA TA = 25°C, at rated DC blocking voltage 2
Peak Reverse Current IRM 125 µA TA = 125°C, at rated DC blocking voltage 2
Typical Total Capacitance CT 20 pF 1.0 MHz, applied reverse voltage 4.0V DC 2
Typical Thermal Resistance, Junction to Terminal RθJT 20 °C/W PC board with 5.0 mm2 (0.013 mm thick) copper pads as heat sink 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: S2BA-13-F
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: s2ba-13-f-etched.step / s2ba-13-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); s2ba-13-f.step / s2ba-13-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (4 pp, sha256 0c36c0ad183abba8, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF