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S25FL256SAGMFIG03

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Infineon Cypress Semicon NOR FLASH, SOIC-16-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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S25FL256SAGMFIG03

Infineon Cypress Semicon · NOR FLASH · SOIC-16-300mil

S25FL256SAGMFIG03 from Infineon Cypress Semicon, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 HOLD#/IO3 bidirectional Hold input in single/dual SPI mode and IO3 data line in Quad I/O mode.
2 VCC power_in Core supply voltage, 2.7V to 3.6V.
3 RESET# input Hardware reset input; model G (SO footprint with RESET#) bonds this connector to the device RESET# signal.
4 DNU unconnected Do not use; leave unconnected.
5 DNU unconnected Do not use; leave unconnected.
6 RFU unconnected Reserved for future use; leave unconnected.
7 CS# input Chip select input that enables the device and frames SPI commands.
8 SO/IO1 bidirectional Serial data output in single SPI mode and IO1 in dual/quad modes.
9 WP#/IO2 bidirectional Write protect input in single/dual mode and IO2 data line in Quad I/O mode.
10 VSS power_in Ground reference for the device.
11 DNU unconnected Do not use; leave unconnected.
12 DNU unconnected Do not use; leave unconnected.
13 NC unconnected No internal connection.
14 VIO/RFU unconnected In model G the I/O supply is bonded to VCC within the package, so this connector is left unconnected (RFU).
15 SI/IO0 bidirectional Serial data input in single SPI mode and IO0 in dual/quad modes.
16 SCK input Serial clock input; SPI clock modes 0 and 3 are supported.

Key specifications

Parameter Value
Manufacturer Infineon Cypress Semicon
Package SOIC-16-300mil
Category Memory
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Low Voltage VIL -0.5 V 27
Input Leakage Current ILI -2 2 µA VCC = VCC Max, VIN = VIH or VIL 27
Output Leakage Current ILO -2 2 µA VCC = VCC Max, VIN = VIH or VIL 27
Active Power Supply Current (READ) Serial SDR@50 MHz ICC1 16 mA Serial SDR@50 MHz; outputs unconnected during read data return 27
Active Power Supply Current (READ) Serial SDR@133 MHz ICC1 33 mA Serial SDR@133 MHz; outputs unconnected during read data return 27
Active Power Supply Current (READ) Quad SDR@80 MHz ICC1 50 mA Quad SDR@80 MHz; outputs unconnected during read data return 27
Active Power Supply Current (READ) Quad SDR@104 MHz ICC1 61 mA Quad SDR@104 MHz; outputs unconnected during read data return 27
Active Power Supply Current (Page Program) ICC2 100 mA CS# = VIO 27
Active Power Supply Current (WRR) ICC3 100 mA CS# = VIO 27
Active Power Supply Current (SE) ICC4 100 mA CS# = VIO 27
Active Power Supply Current (BE) ICC5 100 mA CS# = VIO 27
Standby Current (Industrial) ISB 70 100 µA RESET#, CS# = VIO; SI, SCK = VIO or VSS, Industrial Temp 27
SCK Clock Frequency for READ and 4READ instructions FSCK, R 50 MHz VIO = VCC 2.7 V to 3.6 V 32
SCK Clock Frequency for single commands FSCK, C 133 MHz VIO = VCC 2.7 V to 3.6 V 32
SCK Clock Frequency for dual and quad commands FSCK, C 104 MHz DOR, 4DOR, QOR, 4QOR, DIOR, 4DIOR, QIOR, 4QIOR; VIO = VCC 2.7 V to 3.6 V 32
SCK Clock Frequency for QPP and 4QPP commands FSCK, QPP 80 MHz VIO = VCC 2.7 V to 3.6 V 32
Clock Rise Time (slew rate) tCRT, tCLCH 0.1 V/ns 32
Clock Fall Time (slew rate) tCFT, tCHCL 0.1 V/ns 32
CS# High Time (Read Instructions) tCS 10 ns Read instructions 32
CS# High Time (Program/Erase) tCS 50 ns Program/Erase 32
CS# Active Setup Time (relative to SCK) tCSS 3 ns 32
CS# Active Hold Time (relative to SCK) tCSH 3 ns 32
Data in Setup Time tSU 1.5 3000 ns Maximum value only applies during Program/Erase Suspend/Resume commands 32
Data in Hold Time tHD 2 ns 32
Clock Low to Output Valid tV 8 ns Full VCC range 2.7 V to 3.6 V and CL = 30 pF 32
Clock Low to Output Valid tV 7.65 ns Regulated VCC range 3.0 V to 3.6 V and CL = 30 pF 32
Clock Low to Output Valid tV 6.5 ns Regulated VCC range 3.0 V to 3.6 V and CL = 15 pF 32
Output Hold Time tHO 2 ns 32
Output Disable Time tDIS 0 8 ns 32
WP# Setup Time tWPS 20 ns Only applicable as a constraint for WRR when SRWD is set to 1 32
WP# Hold Time tWPH 100 ns Only applicable as a constraint for WRR when SRWD is set to 1 32
HOLD# Active Setup Time (relative to SCK) tHLCH 3 ns 32
HOLD# Active Hold Time (relative to SCK) tCHHH 3 ns 32
HOLD# Non Active Setup Time (relative to SCK) tHHCH 3 ns 32
HOLD# Non Active Hold Time (relative to SCK) tCHHL 3 ns 32
HOLD# enable to Output Invalid tHZ 8 ns 32
HOLD# disable to Output Valid tLZ 8 ns 32
Reset Setup (RESET# HIGH before RESET# LOW) tRS 50 ns 31
Reset Pulse Hold (RESET# LOW to CS# LOW) tRPH 35 µs 31
RESET# Pulse Width tRP 200 ns 31
Reset Hold (RESET# HIGH before CS# LOW) tRH 50 ns 31
Input Capacitance (SCK, CS#, RESET#) CIN 8 pF 1 MHz 30
Output Capacitance (All I/O) COUT 8 pF 1 MHz 30
VCC (Minimum Operation Voltage) VCC (min) 2.7 V 26
VCC (Cut-Off Where Re-initialization is Needed) VCC (cut-off) 2.4 V 26
VCC to Read Operation (power-up time) tPU 300 µs VCC (min) to read operation 26
VCC Low Time tPD 15 µs VCC (low) 26
VCC supply voltage (absolute maximum) VCC -0.5 4 V 24
VIO supply voltage (absolute maximum) VIO -0.5 4 V 24
Storage Temperature (plastic packages) -65 150 °C 24
Ambient Temperature with Power Applied -65 125 °C 24
Output Short Circuit Current 100 mA 24
VCC operating range VCC 2.7 3.6 V 24
VIO operating range VIO 1.65 V Upper limit printed as VCC + 200 mV 24
Ambient Temperature (Industrial, I) TA -40 85 °C 24
Thermal resistance, junction to ambient (SO16 package, S25FL256) Theta JA 37 °C/W SO316 column 24

CAD (KiCad official)

  • Symbol: S25FL256SAGMFIG03
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
  • 3D model files: s25fl256sagmfig03-etched.step / s25fl256sagmfig03-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); s25fl256sagmfig03.step / s25fl256sagmfig03.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Cypress Semicon datasheet (147 pp, sha256 397c9c5f636021b6, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF