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S25FL128SAGMFI001
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Infineon Cypress Semicon NOR FLASH, SOIC-16-300mil. Pinout reviewed by a person against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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S25FL128SAGMFI001
Infineon Cypress Semicon · NOR FLASH · SOIC-16-300mil
S25FL128SAGMFI001 from Infineon Cypress Semicon, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | DNU | unconnected | Do Not Use (DNU) pin, to be left unconnected on the 16-lead SOIC package. |
| 2 | VIO/RFU | power_in | Versatile I/O power supply or RFU; some device models bond this pin to the device I/O supply, while other models bond the I/O supply to VCC inside the package and leave this pin unconnected. |
| 3 | SI/IO0 | bidirectional | Serial Input (SI) / IO0 signal of the SPI interface, as named in the 16-lead SOIC connection diagram; the functional definition is in Section 2.6, which is not in the supplied pages. |
| 4 | SCK | input | Serial Clock (SCK) input for the SPI interface, as named in the 16-lead SOIC connection diagram; the timing limits are in Section 5, which is not in the supplied pages. |
| 5 | DNU | unconnected | Do Not Use (DNU) pin, to be left unconnected; datasheet revision *A corrected this pin from NC to DNU. |
| 6 | DNU | unconnected | Do Not Use (DNU) pin, to be left unconnected on the 16-lead SOIC package. |
| 7 | DNU | unconnected | Do Not Use (DNU) pin, to be left unconnected on the 16-lead SOIC package. |
| 8 | VSS | power_in | Supply and signal ground (VSS) for the device. |
| 9 | WP#/IO2 | bidirectional | Write Protect (WP#) / IO2 signal, as named in the 16-lead SOIC connection diagram; the functional definition is in Section 2.8, which is not in the supplied pages. |
| 10 | RFU | unconnected | Reserved for Future Use (RFU) pin, not to be connected. |
| 11 | CS# | input | Chip Select (CS#) input for the SPI interface, as named in the 16-lead SOIC connection diagram; the functional definition is in Section 2.5, which is not in the supplied pages. |
| 12 | SO/IO1 | bidirectional | Serial Output (SO) / IO1 signal of the SPI interface, as named in the 16-lead SOIC connection diagram; the functional definition is in Section 2.7, which is not in the supplied pages. |
| 13 | NC | unconnected | Not Connected (NC) pin; datasheet revision *A corrected this pin from DNU to NC. |
| 14 | RESET#/RFU | input | RESET# or RFU; on models that bond this pin to RESET#, it is the active-low device reset, while other models bond RESET# to VCC inside the package and leave this pin unconnected. |
| 15 | VCC | power_in | Core voltage supply (VCC), specified at 2.7 V to 3.6 V. |
| 16 | HOLD#/IO3 | bidirectional | Hold (HOLD#) / IO3 signal, as named in the 16-lead SOIC connection diagram; the functional definition is in Section 2.9, which is not in the supplied pages. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Cypress Semicon |
| Package | SOIC-16-300mil |
| Category | Memory |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Low Voltage | VIL | -0.5 | V | Max printed as 0.2 x VIO | 26 | ||
| Input Leakage Current | ILI | -2 | 2 | µA | VCC = VCC Max, VIN = VIH or VIL | 26 | |
| Output Leakage Current | ILO | -2 | 2 | µA | VCC = VCC Max, VIN = VIH or VIL | 26 | |
| Active Power Supply Current (READ) | ICC1 | 16 | mA | Serial SDR@50 MHz; outputs unconnected during read data return | 26 | ||
| Active Power Supply Current (READ) | ICC1 | 33 | mA | Serial SDR@133 MHz; outputs unconnected during read data return | 26 | ||
| Active Power Supply Current (READ) | ICC1 | 50 | mA | Quad SDR@80 MHz; outputs unconnected during read data return | 26 | ||
| Active Power Supply Current (READ) | ICC1 | 61 | mA | Quad SDR@104 MHz; outputs unconnected during read data return | 26 | ||
| Active Power Supply Current (READ) | ICC1 | 75 | mA | Quad DDR@66 MHz; outputs unconnected during read data return | 26 | ||
| Active Power Supply Current (READ) | ICC1 | 90 | mA | Quad DDR@80 MHz; outputs unconnected during read data return | 26 | ||
| Active Power Supply Current (Page Program) | ICC2 | 100 | mA | CS# = VIO | 26 | ||
| Active Power Supply Current (WRR) | ICC3 | 100 | mA | CS# = VIO | 26 | ||
| Active Power Supply Current (SE) | ICC4 | 100 | mA | CS# = VIO | 26 | ||
| Active Power Supply Current (BE) | ICC5 | 100 | mA | CS# = VIO | 26 | ||
| Standby Current (Industrial) | ISB | 70 | 100 | µA | RESET#, CS# = VIO; SI, SCK = VIO or VSS, Industrial Temp | 26 | |
| Storage Temperature, Plastic Packages | TSTG | -65 | 150 | °C | 23 | ||
| Ambient Temperature with Power Applied | TA | -65 | 125 | °C | Power applied | 23 | |
| VCC Supply Voltage (absolute maximum) | VCC | -0.5 | 4 | V | 23 | ||
| VIO Supply Voltage (absolute maximum) | VIO | -0.5 | 4 | V | 23 | ||
| Input Voltage with respect to Ground (VSS) | -0.5 | V | Max printed as +(VIO + 0.5V) | 23 | |||
| Output Short Circuit Current | 100 | mA | No more than one output shorted to ground at a time; duration not greater than one second | 23 | |||
| Thermal Resistance, junction to ambient (SO16 package) | θJA | 38 | °C/W | S25FL128S, SO316 package column | 23 | ||
| VCC (Minimum Operation Voltage) | VCC (min) | 2.7 | V | 25 | |||
| VCC (Cut-off, re-initialization needed) | VCC (cut-off) | 2.4 | V | 25 | |||
| VCC (Low Voltage for Initialization to Occur) | VCC (low) | 1.6 | V | 25 | |||
| VCC (Low Voltage for Initialization to Occur at Embedded) | VCC (low) | 2.3 | V | At embedded operation | 25 | ||
| VCC (min) to Read Operation Time | tPU | 300 | µs | VCC (min) to read operation | 25 | ||
| VCC (low) Time | tPD | 15 | µs | VCC (low) | 25 |
CAD (KiCad official)
- Symbol:
S25FL128SAGMFI001 - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
- 3D model files:
s25fl128sagmfi001-etched.step/s25fl128sagmfi001-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);s25fl128sagmfi001.step/s25fl128sagmfi001.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Cypress Semicon datasheet (146 pp, sha256
4cdc2a61d3d31251, retrieved 2026-10-21, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).