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Contents

README

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S1W

LGE · Diodes - General Purpose · SMA(DO-214AC)

S1W from LGE, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode, marked by the cathode band on the SMA/DO-214AC body; S1W is a rectifier with 1.0 A average forward current (I(AV)) and 1.1 V maximum forward voltage at 1.0 A.
2 A passive Anode, the terminal opposite the cathode band; the datasheet rates the S1 series for peak forward surge current of 30 A (8.3 ms half sine-wave).

Key specifications

Parameter Value
Manufacturer LGE
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Recurrent Peak Reverse Voltage VRRM 1600 V 1
Maximum RMS Voltage VRMS 780 V 1
Maximum DC Blocking Voltage VDC 1600 V 1
Maximum Average Forward Rectified Current I(AV) 1 A @TL=110 °C 1
Peak Forward Surge Current IFSM 30 A 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) 1
Maximum Instantaneous Forward Voltage VF 1.1 V @ 1.0A 1
Maximum DC Reverse Current at 25 °C IR 1 uA @TA=25 °C at rated DC blocking voltage 1
Maximum DC Reverse Current at 125 °C IR 50 uA @TA=125 °C at rated DC blocking voltage 1
Non-Repetitive Peak Reverse Avalanche Energy EAS 5 mJ at 25 °C, IAS=1A, L=10mH 1
Operating Temperature Range TJ -55 150 °C 1
Storage Temperature Range TSTG -55 150 °C 1
Typical Reverse Recovery Time Trr 1.5 uS IF=0.5A, IR=1.0A, IRR=0.25A 1
Typical Junction Capacitance Cj 12 pF 1 MHz, VR=4.0 V 1
Typical Thermal Resistance, junction to lead RθJL 30 °C/W P.C. board with 0.2" x 0.2" (5.0mm x 5.0mm) copper pad areas 1
Typical Thermal Resistance, junction to ambient RθJA 85 °C/W P.C. board with 0.2" x 0.2" (5.0mm x 5.0mm) copper pad areas 1

CAD (KiCad official)

  • Symbol: S1W
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: s1w-etched.step / s1w-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); s1w.step / s1w.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LGE datasheet (2 pp, sha256 eb3d784c9b75959a, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF