component

S1B-13-F

Public Made by Adom

by adom

Diodes Incorporated Diodes - General Purpose, SMA(DO-214AC). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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S1B-13-F

Diodes Incorporated · Diodes - General Purpose · SMA(DO-214AC)

S1B-13-F from Diodes Incorporated, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 100 V 2
Working Peak Reverse Voltage VRWM 100 V 2
DC Blocking Voltage VR 100 V 2
RMS Reverse Voltage VR(RMS) 70 V 2
Average Rectified Output Current IO 1 A @ TT = +100°C 2
Non-Repetitive Peak Forward Surge Current IFSM 30 A 8.3ms single half sine-wave superimposed on rated load 2
Forward Voltage VFM 1.1 V @ IF = 1.0A 2
Peak Reverse Leakage Current IRM 5 μA @ TA = +25°C, at rated DC blocking voltage 2
Peak Reverse Leakage Current IRM 100 μA @ TA = +125°C, at rated DC blocking voltage 2
Reverse Recovery Time trr 1.8 3 μs IF = 0.5A, IR = 1.0A, IRR = 0.25A 2
Operating and Storage Temperature Range TJ, TSTG -65 150 °C 2
Typical Thermal Resistance, Junction to Terminal RθJT 30 °C/W Junction to terminal; unit mounted on PC board with 5.0 mm2 copper pads as heat sink (Note 5) 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Lead-Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: S1B-13-F
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: s1b-13-f-etched.step / s1b-13-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); s1b-13-f.step / s1b-13-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 b02c2d1278212e6c, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF