component
S150P06G
Public Made by Adomby adom
HL MOSFETs, TO-263. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
S150P06G
HL · MOSFETs · TO-263
S150P06G from HL, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal of the P-channel MOSFET, with gate-source voltage rated at ±20 V (VGS). |
| 2 | D | passive | Drain terminal, rated for drain-source voltage VDS = -60 V and continuous drain current ID = -150 A at TC = 25°C. |
| 3 | S | passive | Source terminal, the reference for the gate-source voltage VGS of ±20 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HL |
| Package | TO-263 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -60 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous Drain Current | ID | -150 | A | TC=25°C | 1 | ||
| Continuous Drain Current | ID | -91.7 | A | TC=100°C | 1 | ||
| Pulsed Drain Current | IDM | -580 | A | Note 1: repetitive rating; pulse width limited by maximum junction temperature | 1 | ||
| Single Pulse Avalanche Energy | EAS | 2058 | mJ | Note 2: VDD=30V, L=0.3mH, RG=25Ω, Starting Tj=25℃ | 1 | ||
| Power Dissipation | PD | 183 | W | TC = 25℃ | 1 | ||
| Operating junction and storage temperature | TJ, TSTG | -55 | 150 | ℃ | 1 | ||
| Maximum Temperature for Soldering | TL | 260 | ℃ | 1 | |||
| Thermal Resistance Junction-Case | RθJC | 0.68 | ℃/W | 2 | |||
| Thermal Resistance, Junction-to-Ambient | RθJA | 60 | ℃/W | 2 | |||
| Drain-Source Breakdown Voltage | V(BR)DSS | -60 | V | VGS = 0V, ID = -250µA | 2 | ||
| Gate-body Leakage current | lGSS | -100 | 100 | nA | VDS = 0V, VGS = ±20V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 1 | µA | VDS = -60V, VGS = 0V | 2 | ||
| Gate-Threshold Voltage | VGS(th) | -2 | -2.4 | -2.8 | V | VDS =VGS , ID = -250µA | 2 |
| Drain-Source On-Resistance | RDS(on) | 3.4 | 4.1 | mΩ | VGS = -10V, ID = -20A | 2 | |
| Diode Forward Current | IS | -150 | A | TC=25℃ | 2 | ||
| Diode Forward Voltage | VSD | -1.2 | V | IS=-20A, VGS=0V | 2 | ||
| Input Capacitance | CISS | 9123 | pF | VDS = -30V,VGS =0V, f =1MHz | 2 | ||
| Output Capacitance | COSS | 1583 | pF | 2 | |||
| Reverse Transfer Capacitance | CRSS | 85.6 | pF | 2 | |||
| Total Gate Charge | Qg | 135 | nC | VGS = -10V,VDS = -30V, ID = -10A | 2 | ||
| Gate-Source Charge | Qgs | 28 | nC | 2 | |||
| Gate-Drain Charge | Qgd | 22.4 | nC | 2 | |||
| Turn-On Delay Time | Td(on) | 70 | ns | VGS = -10V, VDS = -30V, RG = 3Ω, ID = -10A | 2 | ||
| Rise Time | TR | 45 | ns | 2 | |||
| Turn-Off Delay Time | Td(off) | 165 | ns | 2 | |||
| Fall Time | TF | 50 | ns | 2 | |||
| Reverse Recovery time | Trr | 45 | ns | IS=-10A, VDD=-30V, dI/dt=100A/μs | 2 | ||
| Reverse Recovery Charge | Qrr | 100 | nC | 2 |
CAD (KiCad official)
- Symbol:
S150P06G - Footprint:
Package_TO_SOT_SMD:TO-263-2 - 3D model: TO-263 (KiCad packages3D, STEP)
- 3D model files:
s150p06g-etched.step/s150p06g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);s150p06g.step/s150p06g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HL datasheet (8 pp, sha256
7c81453ad6666c39, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusoff(skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# S150P06G
**HL** · MOSFETs · TO-263
S150P06G from HL, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal of the P-channel MOSFET, with gate-source voltage rated at ±20 V (VGS). |
| 2 | D | passive | Drain terminal, rated for drain-source voltage VDS = -60 V and continuous drain current ID = -150 A at TC = 25°C. |
| 3 | S | passive | Source terminal, the reference for the gate-source voltage VGS of ±20 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HL |
| Package | TO-263 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | | | -60 | V | | 1 |
| Gate-Source Voltage | VGS | -20 | | 20 | V | | 1 |
| Continuous Drain Current | ID | | | -150 | A | TC=25°C | 1 |
| Continuous Drain Current | ID | | | -91.7 | A | TC=100°C | 1 |
| Pulsed Drain Current | IDM | | | -580 | A | Note 1: repetitive rating; pulse width limited by maximum junction temperature | 1 |
| Single Pulse Avalanche Energy | EAS | | | 2058 | mJ | Note 2: VDD=30V, L=0.3mH, RG=25Ω, Starting Tj=25℃ | 1 |
| Power Dissipation | PD | | | 183 | W | TC = 25℃ | 1 |
| Operating junction and storage temperature | TJ, TSTG | -55 | | 150 | ℃ | | 1 |
| Maximum Temperature for Soldering | TL | | | 260 | ℃ | | 1 |
| Thermal Resistance Junction-Case | RθJC | | | 0.68 | ℃/W | | 2 |
| Thermal Resistance, Junction-to-Ambient | RθJA | | | 60 | ℃/W | | 2 |
| Drain-Source Breakdown Voltage | V(BR)DSS | -60 | | | V | VGS = 0V, ID = -250µA | 2 |
| Gate-body Leakage current | lGSS | -100 | | 100 | nA | VDS = 0V, VGS = ±20V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 1 | µA | VDS = -60V, VGS = 0V | 2 |
| Gate-Threshold Voltage | VGS(th) | -2 | -2.4 | -2.8 | V | VDS =VGS , ID = -250µA | 2 |
| Drain-Source On-Resistance | RDS(on) | | 3.4 | 4.1 | mΩ | VGS = -10V, ID = -20A | 2 |
| Diode Forward Current | IS | | | -150 | A | TC=25℃ | 2 |
| Diode Forward Voltage | VSD | | | -1.2 | V | IS=-20A, VGS=0V | 2 |
| Input Capacitance | CISS | | 9123 | | pF | VDS = -30V,VGS =0V, f =1MHz | 2 |
| Output Capacitance | COSS | | 1583 | | pF | | 2 |
| Reverse Transfer Capacitance | CRSS | | 85.6 | | pF | | 2 |
| Total Gate Charge | Qg | | 135 | | nC | VGS = -10V,VDS = -30V, ID = -10A | 2 |
| Gate-Source Charge | Qgs | | 28 | | nC | | 2 |
| Gate-Drain Charge | Qgd | | 22.4 | | nC | | 2 |
| Turn-On Delay Time | Td(on) | | 70 | | ns | VGS = -10V, VDS = -30V, RG = 3Ω, ID = -10A | 2 |
| Rise Time | TR | | 45 | | ns | | 2 |
| Turn-Off Delay Time | Td(off) | | 165 | | ns | | 2 |
| Fall Time | TF | | 50 | | ns | | 2 |
| Reverse Recovery time | Trr | | 45 | | ns | IS=-10A, VDD=-30V, dI/dt=100A/μs | 2 |
| Reverse Recovery Charge | Qrr | | 100 | | nC | | 2 |
## CAD (KiCad official)
- Symbol: `S150P06G`
- Footprint: `Package_TO_SOT_SMD:TO-263-2`
- 3D model: TO-263 (KiCad packages3D, STEP)
- 3D model files: `s150p06g-etched.step` / `s150p06g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `s150p06g.step` / `s150p06g.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HL datasheet](docs/s150p06g-datasheet.pdf) (8 pp, sha256 `7c81453ad6666c39`, retrieved 2026-10-27, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `off` (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/s150p06g-datasheet.pdf)