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S110P06T

HL · MOSFETs · TO-220

S110P06T from HL, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal of the P-channel MOSFET, rated for a gate-source voltage of ±20 V.
2 D passive Drain terminal of the P-channel MOSFET, rated for a drain-source voltage of -60 V and continuous drain current of -110 A at TC=25°C.
3 S passive Source terminal of the P-channel MOSFET, serving as the reference for the gate-source voltage and the body diode forward current rating of -110 A.

Key specifications

Parameter Value
Manufacturer HL
Package TO-220
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage V(BR)DSS -60 V VGS=0V, ID=-250µA 2
Gate-body Leakage current IGSS 100 nA VGS=±20V 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS=-60V, VGS=0V 2
Gate-Threshold Voltage VGS(th) -1.6 -2 -2.4 V VDS=VGS, ID=-250µA 2
Drain-Source On-Resistance RDS(on) 5.5 7 mΩ VGS=-10V, ID=-15A 2
Diode Forward Current IS -110 A TC=25℃ 2
Diode Forward Voltage VSD -1.2 V IS=-15A, VGS=0V 2
Drain-Source Voltage VDS -60 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID -110 A TC=25°C 1
Continuous Drain Current ID -70 A TC=100°C 1
Pulsed Drain Current IDM -440 A Footnote 1 1
Single Pulse Avalanche Energy EAS 960 mJ Footnote 2 1
Power Dissipation PD 180 W TC = 25℃ 1
Operating junction and storage temperature TJ, TSTG -55 150 ℃ 1
Maximum Temperature for Soldering TL 260 ℃ 1
Thermal Resistance Junction-Case RθJC 0.69 ℃/W 2
Thermal Resistance, Junction-to-Ambient RθJA 60 ℃/W 2

CAD (KiCad official)

  • Symbol: S110P06T
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220 (KiCad packages3D, STEP)
  • 3D model files: s110p06t-etched.step / s110p06t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); s110p06t.step / s110p06t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HL datasheet (8 pp, sha256 7a918cd3f4970c60, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF