# S10ML-TP

**MCC(Micro Commercial Components)** · Diodes - General Purpose · SMC(DO-214AB)

S10ML-TP from MCC(Micro Commercial Components), in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, the terminal on the end of the package with the cathode mark; the part blocks up to 1000V DC for S10ML and has a 10.0A average forward current at TC=75°C. |
| 2 | A | passive | Anode, the terminal opposite the cathode mark; the part has a maximum forward voltage of 1.20V at IFM=10A and peak forward surge current of 200A (8.3ms half sine). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | SMC(DO-214AB) |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage | VRRM |  |  | 1000 | V |  | 1 |
| Maximum RMS Voltage | VRMS |  |  | 700 | V |  | 1 |
| Maximum DC Blocking Voltage | VDC |  |  | 1000 | V |  | 1 |
| Average Forward Current | IF(AV) |  |  | 10 | A | TC=75°C | 1 |
| Peak Forward Surge Current | IFSM |  |  | 200 | A | 8.3ms, Half Sine | 1 |
| I2t Rating for fusing | I2t |  |  | 166 | A2S | t<8.3ms | 1 |
| Maximum Instantaneous Forward Voltage | VF |  |  | 1.2 | V | IFM=10A; TJ=25°C; pulse width 200 μsec, duty cycle 2% | 1 |
| Maximum DC Reverse Current at Rated DC Blocking Voltage | IR |  |  | 10 | μA | TJ=25°C | 1 |
| Operating Junction Temperature Range | TJ | -55 |  | 150 | °C |  | 1 |
| Storage Temperature Range | TSTG | -55 |  | 150 | °C |  | 1 |
| Typical Thermal Resistance Junction to Case | RθJC |  | 17 |  | °C/W |  | 1 |
| Typical Thermal Resistance Junction to Ambient | RθJA |  | 47 |  | °C/W |  | 1 |
| Typical Thermal Resistance Junction to Lead | RθJL |  | 13 |  | °C/W |  | 1 |

## CAD (KiCad official)

- Symbol: `S10ML-TP`
- Footprint: `Diode_SMD:D_SMC`
- 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
- 3D model files: `s10ml-tp-etched.step` / `s10ml-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `s10ml-tp.step` / `s10ml-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC(Micro Commercial Components) datasheet](docs/s10ml-tp-datasheet.pdf) (3 pp, sha256 `b09a39e1d94d9d3a`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/s10ml-tp-datasheet.pdf)