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S0603-F-0.75A
Public Made by Adomby adom
SART Nanjing Sart Tech Disposable Fuses, 0603. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownS0603-F-0.75A
SART Nanjing Sart Tech · Disposable Fuses · 0603
S0603-F-0.75A from SART Nanjing Sart Tech, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | SART Nanjing Sart Tech |
| Package | 0603 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating temperature | -55 | 125 | ℃ | Operating temperature (product features) | 1 | ||
| Opening time at 100% of rating (no fusing) | 4 | hours | 100% of current rating, no fusing | 3 | |||
| Opening time at 250% of rating | 20 | sec | 250% of current rating, 0.5A~0.75A | 3 | |||
| Opening time at 1000% of rating | 0.1 | ms | 1000% of current rating, 0.5A~6.0A | 3 | |||
| Temperature rise | ΔT | 75 | ℃ | 100% of current rating, UL248-14 | 4 | ||
| Voltage drop deviation between mean values | 15 | % | 100% of current rating, IEC60127-4 | 4 | |||
| Endurance test resistance change | /ΔR/ | 10 | % | 100 cycles of 1In for 1h ON, 15min OFF, then 1h at 125%In; IEC60127-4 | 4 | ||
| Solderability coverage | 95 | % | 240℃±5℃, 3sec±0.5sec; IEC60127-4, MIL-STD-202 Method 208 | 4 | |||
| Resistance to soldering resistance change | /ΔR/ | 10 | % | 260℃±5℃, 10sec±0.5sec; MIL-STD-202 Method 210 | 4 | ||
| Bending test resistance change | /ΔR/ | 10 | % | Distance between holding points 90mm, bending 1mm, time 10s | 4 | ||
| High temperature operating life resistance change | /ΔR/ | 10 | % | T=70℃±2℃, 60%In, 96 hours; no fusing; MIL-STD-202 Method 108 | 4 | ||
| Humidity (steady state) resistance change | /ΔR/ | 10 | % | T=40℃±2℃, 90%~95%RH, 1000 hours; MIL-STD-202 Method 103 | 4 | ||
| Low temperature storage resistance change | /ΔR/ | 10 | % | T=-55℃±3℃, 96 hours; IEC60068-2-1 | 4 | ||
| High temperature storage resistance change | /ΔR/ | 10 | % | T=125℃±2℃, 96 hours; IEC60068-2-2 | 4 | ||
| Salt spray resistance change | /ΔR/ | 10 | % | 5% salt solution, 48 hours; MIL-STD-202 Method 101 | 4 | ||
| Thermal shock resistance change | /ΔR/ | 10 | % | 100 cycles between -65℃/+125℃, 60 minutes each extreme; MIL-STD-202 Method 107 | 4 | ||
| Rated current | 0.75 | A | Ampere Rating | 1 | |||
| Rated voltage | 32 | V | Voltage Rating, DC | 1 | |||
| Interrupting rating | 50 | A | 32V DC; applies to 0.5A~3.5A rating (shared cell with 0.5A row); without permanent arcing, ignition or bursting | 1 | |||
| Typical cold DCR | DCR | 389 | mΩ | Measured at ≤10% rated current and 25℃ | 1 | ||
| Typical melting I2T | I2T | 0.0177 | A2s | Melting I2T at 10 times of rated current | 1 | ||
| Infrared reflow peak temperature | 260 | ℃ | Infrared reflow, recommended reflow profile | 5 | |||
| Infrared reflow time | 5 | sec | Infrared reflow, time at temperature | 5 | |||
| Wave soldering reservoir temperature | 260 | ℃ | Wave soldering reservoir | 5 | |||
| Wave soldering time in reservoir | 10 | sec | Wave soldering, time in reservoir | 5 | |||
| Hand soldering temperature | 350 | ℃ | Hand soldering | 5 | |||
| Hand soldering time | 5 | sec | Hand soldering | 5 | |||
| Preheat temperature | Tsmin to Tsmax | 150 | 200 | ℃ | Pb-free assembly reflow profile | 5 | |
| Preheat time | Tsmin to Tsmax | 60 | 120 | sec | Pb-free assembly reflow profile | 5 | |
| Peak temperature | Tp | 260 | ℃ | Pb-free assembly reflow profile | 5 | ||
| Average ramp-up rate | 3 | ℃/sec | Tsmax to Tp, Pb-free assembly | 5 | |||
| Ramp-down rate | 6 | ℃/sec | Pb-free assembly reflow profile | 5 | |||
| Storage ambient temperature | 5 | 30 | ℃ | Recommended storage | 6 | ||
| Storage relative humidity | RH | 25 | 60 | % | Recommended storage | 6 |
CAD (KiCad official)
- Symbol:
S0603-F-0.75A - Footprint:
Fuse:Fuse_0603_1608Metric - 3D model: 0603 (KiCad packages3D, STEP)
- 3D model files:
s0603-f-0-75a-etched.step/s0603-f-0-75a-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);s0603-f-0-75a.step/s0603-f-0-75a.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: SART Nanjing Sart Tech datasheet (6 pp, sha256
327d0da943575adc, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).