component
RY9130
Public Made by Adomby adom
RYCHIP DC-DC Converters, SOT-23-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 17d ago |
| viewers | 17d ago |
| package.json | 17d ago |
| page.json | 17d ago |
| README.md | 17d ago |
| ry9130-etched.glb | 17d ago |
| ry9130-etched.step | 17d ago |
| ry9130-hero.glb | 17d ago |
| ry9130-hero.overlay.json | 17d ago |
| ry9130.glb | 17d ago |
| ry9130.kicad_mod | 17d ago |
| ry9130.kicad_sym | 17d ago |
| ry9130.lbr | 17d ago |
| ry9130.step | 17d ago |
RY9130
RYCHIP · DC-DC Converters · SOT-23-6
RY9130 from RYCHIP, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BS | passive | Bootstrap pin: a capacitor connected between SW and BST is required to form a floating supply across the high-side switch driver. |
| 2 | GND | power_in | Ground pin for the regulator. |
| 3 | FB | input | Adjustable-version feedback input; connect to the center point of the external resistor divider (VFB 0.585V to 0.615V, 0.6V typical). |
| 4 | EN | input | Drive to logic-high to enable the IC and to logic-low to disable it into micro-power shutdown (EN rising threshold 1.4V typical, falling threshold 0.8V typical). |
| 5 | IN | power_in | Power supply pin; input voltage range is 4.5V to 16V. |
| 6 | SW | output | Switching pin connected to the internal power MOSFETs; SW voltage is limited to -0.3V to VIN+0.5V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | RYCHIP |
| Package | SOT-23-6 |
| Category | Power Management (PMIC) |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage Range | 4.5 | 16 | V | 4 | |||
| Feedback Voltage | 0.585 | 0.6 | 0.615 | V | 4 | ||
| Maximum Duty Cycle | 94 | % | VFB=90% | 4 | |||
| Supply Current (Quiescent) | 0.6 | 0.8 | mA | VEN =3.0V | 4 | ||
| Under-Voltage Lockout Wake up VIN Voltage | 4.3 | 4.5 | V | 4 | |||
| Under-Voltage Lockout Shutdown VIN Voltage | 3.6 | 3.8 | V | 4 | |||
| EN Rising Threshold | 1.4 | V | 4 | ||||
| EN Falling Threshold | 0.8 | V | 4 | ||||
| Supply Current (Shutdown) | 4 | uA | VEN =0 or EN = GND | 4 | |||
| High-Side Switch On-Resistance | 70 | mΩ | ISW=100mA | 4 | |||
| Low-Side Switch On-Resistance | 50 | mΩ | ISW=-100mA | 4 | |||
| Valley Switch Current Limit | 4 | A | 4 | ||||
| Over Voltage Protection Threshold | 18 | V | 4 | ||||
| Switching Frequency | 500 | KHz | 4 | ||||
| Minimum Off-Time | 89 | nS | 4 | ||||
| Hysteresis VIN voltage | 500 | mV | 4 | ||||
| Soft Start | 1.5 | mS | 4 | ||||
| Thermal Shutdown | 160 | ℃ | 4 | ||||
| Thermal Hysteresis | 30 | ℃ | 4 | ||||
| VIN voltage | -0.3 | 16 | V | 3 | |||
| EN voltage | -0.3 | 16 | V | 3 | |||
| SW voltage | -0.3 | V | Printed max is VIN+0.5V (expression, not numeric) | 3 | |||
| BS voltage | -0.3 | V | Printed max is Vsw+5V (expression, not numeric) | 3 | |||
| FB voltage | -0.3 | 6 | V | 3 | |||
| Operating junction temperature, TJ | TJ | -40 | 150 | °C | 3 | ||
| Storage temperature | Tstg | -55 | 150 | °C | 3 | ||
| Lead Temperature (Soldering, 10sec.) | 260 | °C | 10 s soldering | 3 | |||
| ESD HBM | V(ESD-HBM) | -2000 | 2000 | V | ANSI/ESDA/JEDEC JS-001-2014, Class 2 | 3 | |
| ESD CDM | V(ESD-CDM) | -200 | 200 | V | ANSI/ESDA/JEDEC JS-002-2014, Class C0b | 3 | |
| Latch-up | ILATCH-UP | -150 | 150 | mA | JEDEC STANDARD NO.78E, Class I | 3 | |
| Operating junction temperature | -40 | 125 | °C | 3 | |||
| Operating temperature range | -40 | 85 | °C | 3 | |||
| Input voltage VIN | VIN | 4.5 | 16 | V | 3 | ||
| Output current | 0 | 3 | A | 3 | |||
| Junction-to-ambient thermal resistance | RθJA | 105 | °C/W | JESD 51-7, 4-layer JEDEC board | 4 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 55 | °C/W | 4 | |||
| Junction-to-board thermal resistance | RθJB | 17.5 | °C/W | 4 | |||
| Junction-to-top characterization parameter | ψJT | 3.5 | °C/W | 4 | |||
| Junction-to-board characterization parameter | ψJB | 17.5 | °C/W | 4 |
CAD (KiCad official)
- Symbol:
RY9130 - Footprint:
Package_TO_SOT_SMD:SOT-23-6 - 3D model: SOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
ry9130-etched.step/ry9130-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ry9130.step/ry9130.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: RYCHIP datasheet (13 pp, sha256
cb5d81a0edc0469c, retrieved 2026-10-16, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).