# RY7317AT6

**RYCHIP** · LED Drivers · SOT-23-6

RY7317AT6 from RYCHIP, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | FB | input | Output current feedback pin; the output current is set as IOUT = 0.1 V / RS1, with the feedback reference at 100 mV typical. |
| 2 | DIM | input | Dimming signal input that must not be left floating; the device is enabled when DIM is above 2.5 V and shut down when DIM is below 1.5 V. |
| 3 | GND | power_in | Ground pin for the device. |
| 4 | IN | power_in | Input supply pin for the 4.5 V to 30 V input range, to be decoupled to GND with a 10 µF ceramic capacitor. |
| 5 | SW | output | Switching pin, which the datasheet says to connect to the 'indicator' (apparent typo for the inductor); absolute maximum SW voltage is -0.3 V to 35 V. |
| 6 | BS | passive | Bootstrap pin that supplies the top-side gate driver, to be decoupled to SW with a 0.1 µF ceramic capacitor; absolute maximum BS voltage is -0.3 V to 35 V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | RYCHIP |
| Package | SOT-23-6 |
| Category | LED Drivers |
| Pins | 6 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VIN voltage (absolute maximum) | VIN | -0.3 |  | 35 | V |  | 3 |
| DIM voltage (absolute maximum) | DIM | -0.3 |  | 10 | V |  | 3 |
| SW voltage (absolute maximum) | SW | -0.3 |  | 35 | V |  | 3 |
| SW voltage transient (absolute maximum) | SW | -5 |  | 35 | V | 10ns transient | 3 |
| BS voltage (absolute maximum) | BS | -0.3 |  | 35 | V |  | 3 |
| Operating junction temperature (absolute maximum) | TJ | -40 |  | 150 | °C |  | 3 |
| Storage temperature | Tstg | -55 |  | 150 | °C |  | 3 |
| Lead temperature (soldering, 10 sec) |  |  |  | 260 | °C | 10 sec soldering | 3 |
| ESD Human Body Model (HBM) | V(ESD-HBM) | -2000 |  | 2000 | V | ANSI/ESDA/JEDEC JS-001-2014 | 3 |
| ESD Charged Device Model (CDM) | V(ESD-CDM) | -200 |  | 200 | V | ANSI/ESDA/JEDEC JS-002-2014 | 3 |
| Latch-up current | ILATCH-UP | -150 |  | 150 | mA | JEDEC STANDARD NO.78E | 3 |
| Input voltage | VIN | 4.5 |  | 30 | V |  | 3 |
| Output current |  | 0 |  | 1 | A |  | 3 |
| Output voltage |  | 0 |  | 10 | V |  | 3 |
| Operating junction temperature |  | -40 |  | 125 | °C |  | 3 |
| Operating temperature range |  | -40 |  | 85 | °C |  | 3 |
| Input Voltage Range |  | 4.5 |  | 30 | V |  | 4 |
| Under-Voltage Lockout Threshold, wake-up VIN voltage |  | 4.1 |  | 4.4 | V |  | 4 |
| Under-Voltage Lockout Threshold, shutdown VIN voltage |  | 3.3 |  | 3.7 | V |  | 4 |
| Feedback Reference Voltage |  | 94 | 100 | 106 | mV | VDIM=3V | 4 |
| Feedback Min Reference Voltage |  | 3 | 5 | 7 | mV | VDIM=1V | 4 |
| High-Side FET On-Resistance |  | 100 | 120 | 140 | mΩ |  | 4 |
| High-Side FET Peak Current Limit |  | 2.5 | 3 | 3.5 | A | TON<800nS | 4 |
| Low-Side FET On-Resistance |  | 60 | 70 | 80 | mΩ |  | 4 |
| Low-Side FET Valley Current Limit |  | 1.1 | 1.3 | 1.5 | A |  | 4 |
| Dimming ON Threshold |  | 2.05 |  | 2.2 | V |  | 4 |
| Dimming OFF Threshold |  | 1.6 |  | 1.75 | V |  | 4 |
| Operation Frequency |  | 0.8 | 1 | 1.2 | MHz |  | 4 |
| Minimum On Time |  | 100 |  | 120 | nS |  | 4 |
| Minimum Off Time |  | 130 |  | 150 | nS |  | 4 |
| Max Duty Cycle |  |  |  | 85 | % |  | 4 |
| Shutdown Supply Current |  |  | 300 |  | uA | VIN=30V | 4 |
| Quiescent Current |  |  | 760 |  | uA | VDIM=3V, VFB=0.12V | 4 |
| Hysteresis VIN voltage (UVLO) |  |  | 400 |  | mV |  | 4 |
| Thermal Shutdown |  |  | 160 |  | ℃ |  | 4 |
| Thermal Hysteresis |  |  | 20 |  | ℃ |  | 4 |
| Junction-to-ambient thermal resistance | RθJA |  | 105 |  | °C/W |  | 4 |
| Junction-to-case (top) thermal resistance | RθJC(top) |  | 55 |  | °C/W |  | 4 |
| Junction-to-board thermal resistance | RθJB |  | 17.5 |  | °C/W |  | 4 |
| Junction-to-top characterization parameter | ψJT |  | 3.5 |  | °C/W |  | 4 |
| Junction-to-board characterization parameter | ψJB |  | 17.5 |  | °C/W |  | 4 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper |  | that connects to GND. The inductor should be placed as close as possible to the SW pin and output capacitor. 2. Minimize the copper area of the switch node. The SW terminals should be directly connect | 11 |

## CAD (KiCad official)

- Symbol: `RY7317AT6`
- Footprint: `Package_TO_SOT_SMD:SOT-23-6`
- 3D model: SOT-23-6 (KiCad packages3D, STEP)
- 3D model files: `ry7317at6-etched.step` / `ry7317at6-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ry7317at6.step` / `ry7317at6.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [RYCHIP datasheet](docs/ry7317at6-datasheet.pdf) (12 pp, sha256 `c3fafe1090ce23ad`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ry7317at6-datasheet.pdf)