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RY6050-30M5R

RYCHIP · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-5

RY6050-30M5R from RYCHIP, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Input voltage pin for the regulator; recommended VIN is 2 V to 5.5 V and the absolute maximum VIN voltage is 6 V.
2 GND power_in Ground pin.
3 EN input Enable control (active high): driving EN over 0.9 V turns on the regulator, and driving EN below 0.4 V puts the regulator into shutdown mode.
4 NC unconnected Not connected.
5 OUT power_out Output voltage pin for the regulator; output current is rated up to 500 mA.

Key specifications

Parameter Value
Manufacturer RYCHIP
Package SOT-23-5
Category Power Management (PMIC)
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage VIN 2 5.5 V 9
Output Current Limit ICL 450 500 550 mA VIN=5V, 1.8V<VOUT<3.3V 9
Short-Circuit Current Limit ISC 500 mA 9
Line Regulation ΔVOUT/ΔVIN×VOUT 0.2 0.6 %/V VOUT(S)+0.5 V≤VIN≤7V, IOUT=300mA 9
Load Regulation ΔVOUT/VOUT 0.5 2 % VIN=VOUT(S)+1.0 V 9
Input Current at EN pin IEN -0.1 0.1 μA VIN=VEN=VOUT(T)+1V 9
Power Supply Rejection Ratio PSRR 60 dB VOUT=2.5V, IOUT=20mA, f = 10kHz 9
Output Voltage Tolerance -2 2 % 1
Operating junction temperature -40 125 °C 8
Operating temperature range -40 85 °C 8
Input voltage VIN VIN 2 5.5 V 8
Output current 0 500 mA 8
VIN voltage 2 6 V 7
VOUT voltage 1 5 V 7
Operating Ambient Temperature -40 85 °C 7
Maximum junction temperature 150 °C 7
Storage temperature Tstg -50 85 °C 7
Thermal Shutdown Temperature TSD 155 °C TJ rising 9
Thermal Shutdown Hysteresis ΔTSD 15 °C TJ falling from shutdown 9
Junction-to-ambient thermal resistance RθJA 195 °C/W SOT23-5 package, JEDEC 4-layer board 8
Junction-to-case (top) thermal resistance RθJC(top) 102 °C/W SOT23-5 package 8
Junction-to-board thermal resistance RθJB 46 °C/W SOT23-5 package 8
Junction-to-top characterization parameter ψJT 8.5 °C/W SOT23-5 package 8
Junction-to-board characterization parameter ψJB 45 °C/W SOT23-5 package 8

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper 2. The ground connections for CIN and COUT must be back to the IC’s GND pin using as wide and short a copper 11

CAD (KiCad official)

  • Symbol: RY6050-30M5R
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5 (KiCad packages3D, STEP)
  • 3D model files: ry6050-30m5r-etched.step / ry6050-30m5r-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ry6050-30m5r.step / ry6050-30m5r.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RYCHIP datasheet (14 pp, sha256 944e1f94321fbbb9, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF