component
RY3831
Public Made by Adomby adom
RYCHIP DC-DC Converters, ESOP-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
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RY3831
RYCHIP · DC-DC Converters · ESOP-8
RY3831 from RYCHIP, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BST | passive | Bootstrap pin. A capacitor connected between SW and BST forms a floating supply that powers the high-side MOSFET gate driver. |
| 2 | VIN | power_in | Power supply input pin. Accepts 4V to 18V (absolute max 21V). Bypass close to the pin with a ceramic input capacitor. |
| 3 | SW | power_out | Switching node. Connects the internal high-side and low-side MOSFETs to the external inductor. Voltage swings between GND and VIN at 500kHz. |
| 4 | GND | power_in | Ground pin. Tie to the exposed pad and to a large copper area for thermal dissipation. |
| 5 | FB | input | Feedback input for the adjustable output. Connect to the center tap of an external resistor divider from VOUT to GND. Regulated to VFB = 0.923V typical (0.905V - 0.940V). |
| 6 | NC | unconnected | No internal connection. Leave floating or tie to GND per PCB layout convenience. |
| 7 | EN | input | Enable input. Drive logic-high to enable the regulator; drive logic-low to disable and enter micro-power shutdown. Absolute max 21V. |
| 8 | NC | unconnected | No internal connection. Leave floating or tie to GND per PCB layout convenience. |
| 9 | EPAD | power_in | Exposed thermal pad on the package bottom. Electrically GND. Must be soldered to a large ground copper pour for heat dissipation and to meet the 50°C/W θJA rating. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | RYCHIP |
| Package | ESOP-8 |
| Category | PMIC |
| Pins | 9 |
CAD (KiCad official)
- Symbol:
RY3831 - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm - 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files:
ry3831-etched.step/ry3831-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ry3831.step/ry3831.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: RYCHIP datasheet (7 pp, sha256
1febf33afacecd6b, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# RY3831
**RYCHIP** · DC-DC Converters · ESOP-8
RY3831 from RYCHIP, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BST | passive | Bootstrap pin. A capacitor connected between SW and BST forms a floating supply that powers the high-side MOSFET gate driver. |
| 2 | VIN | power_in | Power supply input pin. Accepts 4V to 18V (absolute max 21V). Bypass close to the pin with a ceramic input capacitor. |
| 3 | SW | power_out | Switching node. Connects the internal high-side and low-side MOSFETs to the external inductor. Voltage swings between GND and VIN at 500kHz. |
| 4 | GND | power_in | Ground pin. Tie to the exposed pad and to a large copper area for thermal dissipation. |
| 5 | FB | input | Feedback input for the adjustable output. Connect to the center tap of an external resistor divider from VOUT to GND. Regulated to VFB = 0.923V typical (0.905V - 0.940V). |
| 6 | NC | unconnected | No internal connection. Leave floating or tie to GND per PCB layout convenience. |
| 7 | EN | input | Enable input. Drive logic-high to enable the regulator; drive logic-low to disable and enter micro-power shutdown. Absolute max 21V. |
| 8 | NC | unconnected | No internal connection. Leave floating or tie to GND per PCB layout convenience. |
| 9 | EPAD | power_in | Exposed thermal pad on the package bottom. Electrically GND. Must be soldered to a large ground copper pour for heat dissipation and to meet the 50°C/W θJA rating. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | RYCHIP |
| Package | ESOP-8 |
| Category | PMIC |
| Pins | 9 |
## CAD (KiCad official)
- Symbol: `RY3831`
- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm`
- 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files: `ry3831-etched.step` / `ry3831-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ry3831.step` / `ry3831.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [RYCHIP datasheet](docs/ry3831-datasheet.pdf) (7 pp, sha256 `1febf33afacecd6b`, retrieved 2026-08-17, tier: lcsc)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ry3831-datasheet.pdf)