component
RUM002N02T2L
Public Made by Adomby adom
ROHM Semicon MOSFETs, SOT-723. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownRUM002N02T2L
ROHM Semicon · MOSFETs · SOT-723
RUM002N02T2L from ROHM Semicon, in a SOT-723. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate input; gate threshold voltage VGS(th) 0.3-1.0 V, maximum gate-source voltage VGSS ±8 V. |
| 2 | S | passive | Source terminal; body diode anode, continuous body-diode forward current IS max 100 mA (Ta=25 °C), VSD max 1.2 V at IS=100 mA. |
| 3 | D | passive | Drain terminal; VDSS 20 V, continuous drain current ID ±200 mA, RDS(on) max 1.2 Ω at VGS=2.5 V / ID=200 mA. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | SOT-723 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain - Source voltage | VDSS | 20 | V | Ta = 25°C, unless otherwise specified | 1 | ||
| Continuous drain current | ID | -200 | 200 | mA | Ta = 25°C, unless otherwise specified | 1 | |
| Pulsed drain current | IDP | -400 | 400 | mA | Pw≦10μs, Duty cycle≦1% | 1 | |
| Gate - Source voltage | VGSS | -8 | 8 | V | Ta = 25°C, unless otherwise specified | 1 | |
| Power dissipation | PD | 150 | mW | Each terminal mounted on a reference land | 1 | ||
| Junction temperature | Tj | 150 | ℃ | Ta = 25°C, unless otherwise specified | 1 | ||
| Operating junction and storage temperature range | Tstg | -55 | 150 | ℃ | Ta = 25°C, unless otherwise specified | 1 | |
| Thermal resistance, junction - ambient | RthJA | 833 | ℃/W | Each terminal mounted on a reference land | 2 | ||
| Drain - Source breakdown voltage | V(BR)DSS | 20 | V | VGS = 0V, ID = 1mA | 2 | ||
| Zero gate voltage drain current | IDSS | 1 | μA | VDS = 20V, VGS = 0V | 2 | ||
| Gate - Source leakage current | IGSS | -10 | 10 | μA | VGS = ±8V, VDS = 0V | 2 | |
| Gate threshold voltage | VGS(th) | 0.3 | 1 | V | VDS = 10V, ID = 1mA | 2 | |
| Static drain - source on - state resistance | RDS(on) | 0.8 | 1.2 | Ω | VGS = 2.5V, ID = 200mA; pulsed | 2 | |
| Static drain - source on - state resistance | RDS(on) | 1 | 1.4 | Ω | VGS = 1.8V, ID = 200mA; pulsed | 2 | |
| Static drain - source on - state resistance | RDS(on) | 1.2 | 2.4 | Ω | VGS = 1.5V, ID = 40mA; pulsed | 2 | |
| Static drain - source on - state resistance | RDS(on) | 1.6 | 4.8 | Ω | VGS = 1.2V, ID = 20mA; pulsed | 2 | |
| Forward transfer admittance | /Yfs/ | 200 | mS | VDS = 10V, ID = 200mA; pulsed | 2 | ||
| Breakdown voltage temperature coefficient | ΔV(BR)DSS/ΔTj | 29 | mV/℃ | ID = 1mA, ΔTj referenced to 25℃ | 2 | ||
| Gate threshold voltage temperature coefficient | ΔVGS(th)/ΔTj | -1.6 | mV/℃ | ID = 1mA, ΔTj referenced to 25℃ | 2 | ||
| Input capacitance | Ciss | 25 | pF | VGS = 0V | 3 | ||
| Output capacitance | Coss | 10 | pF | VDS = 10V | 3 | ||
| Reverse transfer capacitance | Crss | 10 | pF | f = 1MHz | 3 | ||
| Turn - on delay time | td(on) | 5 | ns | VDD ≈ 10V, VGS = 4.0V | 3 | ||
| Rise time | tr | 10 | ns | ID = 150mA | 3 | ||
| Turn - off delay time | td(off) | 15 | ns | RL ≈ 67Ω | 3 | ||
| Fall time | tf | 10 | ns | RG = 10Ω | 3 | ||
| Continuous forward current | IS | 100 | mA | Ta = 25℃ | 3 | ||
| Pulse forward current | ISP | 400 | mA | Pw≦10μs, Duty cycle≦1% | 3 | ||
| Forward voltage | VSD | 1.2 | V | VGS = 0V, IS = 100mA | 3 |
CAD (KiCad official)
- Symbol:
RUM002N02T2L - Footprint:
Package_TO_SOT_SMD:SOT-723 - 3D model: SOT-723, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.5 mm nominal SOT-723 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
rum002n02t2l-etched.step/rum002n02t2l-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rum002n02t2l.step/rum002n02t2l.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ROHM Semicon datasheet (13 pp, sha256
5e9fd598b8278630, retrieved 2026-10-09, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-sonnet-4-6(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).