component
RT9045GSP
Public Made by Adomby adom
Richtek Tech Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, SOIC-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
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page.json+8−5@@ -32,7 +32,7 @@ "number": "1", "name": "VIN", "type": "power_in",- "description": "Input voltage supplying current to the output pin (1V to 5.5V recommended, absolute max 6V). Must be kept lower or equal to VCNTL. Decouple with a large low-ESR ceramic capacitor (typ. 10\u00b5F) placed close to the pin."+ "description": "Input voltage supplying current to the output pin (1V to 5.5V recommended, absolute max 6V). Must be kept lower or equal to VCNTL. Decouple with a large low-ESR ceramic capacitor (typ. 10µF) placed close to the pin." }, { "number": "2",@@ -50,7 +50,7 @@ "number": "4", "name": "VOUT", "type": "power_out",- "description": "Regulator output, regulated to the REFEN voltage to terminate the DDR bus resistors. Capable of sinking and sourcing up to 1.8A. Requires typ. 10\u00b5F ceramic output capacitance to maintain large-signal transient response."+ "description": "Regulator output, regulated to the REFEN voltage to terminate the DDR bus resistors. Capable of sinking and sourcing up to 1.8A. Requires typ. 10µF ceramic output capacitance to maintain large-signal transient response." }, { "number": "5",@@ -62,7 +62,7 @@ "number": "6", "name": "VCNTL", "type": "power_in",- "description": "Control/bias supply for internal control circuitry and gate drive to the output power MOSFETs (5V \u00b15%). Output current drive capability is proportional to VCNTL. Decouple with at least 1\u00b5F to GND; VIN must be kept \u2264 VCNTL."+ "description": "Control/bias supply for internal control circuitry and gate drive to the output power MOSFETs (5V ±5%). Output current drive capability is proportional to VCNTL. Decouple with at least 1µF to GND; VIN must be kept ≤ VCNTL." }, { "number": "7",@@ -80,7 +80,7 @@ "number": "9", "name": "GND (Exposed Pad)", "type": "power_in",- "description": "Exposed thermal pad on the package underside. Must be soldered to a large PCB copper area connected to GND for proper heat sinking and rated power dissipation (2.51W at TA=25\u00b0C, \u03b8JA=39.8\u00b0C/W)."+ "description": "Exposed thermal pad on the package underside. Must be soldered to a large PCB copper area connected to GND for proper heat sinking and rated power dissipation (2.51W at TA=25°C, θJA=39.8°C/W)." } ], "provenance": {@@ -144,5 +144,8 @@ "docs/rt9045gsp-datasheet.pdf", "viewers/symbol.html", "viewers/footprint.html"- ]+ ],+ "visibility": {+ "public": true+ } }