component

RT8290ZSP

Public Made by Adom

by adom

Richtek Tech DC-DC Converters, SOP-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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RT8290ZSP

Richtek Tech · DC-DC Converters · SOP-8-EP

RT8290ZSP from Richtek Tech, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT power_out Bootstrap supply for the high-side gate driver; connect a 10nF or greater ceramic capacitor from BOOT to SW.
2 VIN power_in Voltage supply input with a range of 4.5V to 23V; a suitably large capacitor must be bypassed with this pin.
3 SW output Switching node; connect the output LC filter between SW and the output load.
4 GND power_in Ground; connect to the exposed pad and a large PCB ground for maximum power dissipation.
5 FB input Output voltage feedback input with a 0.925V typical reference (0.911V to 0.939V over 4.5V to 23V VIN).
6 COMP passive Loop compensation node; a series RC network is required from COMP to GND, with an optional additional capacitor from COMP to GND.
7 EN input Enable input: logic high enables the converter, logic low forces shutdown with supply current below 3µA; tie to VIN through a 100k pull-up for automatic startup.
8 SS passive Soft-start control; a capacitor from SS to GND sets the soft-start period, with 0.1µF giving 15.5ms typical.
9 GND power_in Exposed thermal pad that must be soldered to a large PCB and connected to GND for maximum power dissipation.

Key specifications

Parameter Value
Manufacturer Richtek Tech
Package SOP-8-EP
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VIN -0.3 25 V 3
Switching Voltage SW -0.3 V max printed as (VIN + 0.3V) 3
SW (AC) 30ns SW -5 30 V 30ns 3
The Other Pins -0.3 6 V 3
Power Dissipation PD 1.333 W TA = 25°C, SOP-8 (Exposed Pad) 3
Junction Temperature 150 °C 3
Lead Temperature 260 °C soldering, 10 sec 3
Storage Temperature Range -65 150 °C 3
ESD Susceptibility HBM 2 kV Human Body Model 3
ESD Susceptibility MM 200 V Machine Model 3
Supply Voltage VIN 4.5 23 V 3
Enable Voltage VEN 0 5.5 V 3
Junction Temperature Range -40 125 °C 3
Ambient Temperature Range -40 85 °C 3
Junction to Ambient Thermal Resistance θJA 75 °C/W TA = 25°C, four-layer JEDEC 51-7 board 3
Junction to Case Thermal Resistance θJC 15 °C/W measured at exposed pad 3
Shutdown Supply Current 0.3 3 A VEN = 0V 4
Supply Current 0.8 1.2 mA VEN = 3V, VFB = 1V 4
Feedback Voltage VFB 0.911 0.925 0.939 V 4.5V ≤ VIN ≤ 23V 4
High Side Switch Leakage Current 0 10 A VEN = 0V, VSW = 0V 4
Oscillation Frequency fOSC1 300 340 380 kHz 4
EN Input Threshold Logic-High Voltage VIH 2.7 V 4
EN Input Threshold Logic-Low Voltage VIL 0.4 V 4
Input Under Voltage Lockout Threshold VUVLO 3.8 4.2 4.5 V VIN Rising 4

CAD (KiCad official)

  • Symbol: RT8290ZSP
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOP-8-EP (KiCad packages3D, STEP)
  • 3D model files: rt8290zsp-etched.step / rt8290zsp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rt8290zsp.step / rt8290zsp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Richtek Tech datasheet (12 pp, sha256 86e7690908efc448, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF