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RT8075ZQW
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Richtek Tech DC-DC Converters, WDFN-10-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownRT8075ZQW
Richtek Tech · DC-DC Converters · WDFN-10-EP(3x3)
RT8075ZQW from Richtek Tech, in a WDFN-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | EN1 | input | Chip enable for channel 1, active high; VEN_H is 1.5V minimum up to VIN and VEN_L is 0.4V maximum, with VIN from 2.5V to 5.5V. |
| 2 | FB1 | input | Feedback input for channel 1, which senses the output divider against the internal 0.6V reference (0.588V to 0.612V). |
| 3 | VIN2 | power_in | Power supply input for channel 2, rated 2.5V to 5.5V with an absolute maximum of 6.5V. |
| 4 | GND | power_in | Ground; listed with pins 9 and 11 as the exposed pad, which must be soldered to a large PCB and connected to GND for maximum power dissipation. |
| 5 | LX2 | output | Switching node of channel 2, with voltage limited to -0.3V to (VIN + 0.3V) absolute maximum. |
| 6 | EN2 | input | Chip enable for channel 2, active high; VEN_H is 1.5V minimum up to VIN and VEN_L is 0.4V maximum, with VIN from 2.5V to 5.5V. |
| 7 | FB2 | input | Feedback input for channel 2, which senses the output divider against the internal 0.6V reference (0.588V to 0.612V). |
| 8 | VIN1 | power_in | Power supply input for channel 1, rated 2.5V to 5.5V with an absolute maximum of 6.5V. |
| 9 | GND | power_in | Ground; listed with pins 4 and 11 as the exposed pad, which must be soldered to a large PCB and connected to GND for maximum power dissipation. |
| 10 | LX1 | output | Switching node of channel 1, with voltage limited to -0.3V to (VIN + 0.3V) absolute maximum. |
| 11 | GND | power_in | Ground exposed pad (printed as GND 11 on the pin configuration), which must be soldered to a large PCB and connected to GND for maximum power dissipation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Richtek Tech |
| Package | WDFN-10-EP(3x3) |
| Category | Power Management (PMIC) |
| Pins | 11 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage Range | VIN | 2.5 | 5.5 | V | 3 | ||
| Reference Voltage | VREF | 0.588 | 0.6 | 0.612 | V | 3 | |
| Shutdown Current | ISHDN | 0.1 | 1 | μA | 3 | ||
| Oscillator Frequency | fOSC | 1 | 1.25 | 1.5 | MHz | VIN = 3.6V, IOUT = 300mA | 3 |
| EN1 High-Level Input Voltage | VEN_H | 1.5 | V | VIN = 2.5V to 5.5V | 3 | ||
| EN1 Low-Level Input Voltage | VEN_L | 0.4 | V | VIN = 2.5V to 5.5V | 3 | ||
| Peak Current Limit | ILIM | 1.2 | 1.5 | 2.1 | A | VIN = 2.5V to 5.5 V | 3 |
| Output Line Regulation | 0.04 | 0.4 | %/V | VIN = 2.5V to 5.5V (Note 5) | 3 | ||
| Supply Input Voltage | VIN | 2.5 | 5.5 | V | 3 | ||
| Junction Temperature Range | TJ | -40 | 125 | °C | 3 | ||
| Ambient Temperature Range | TA | -40 | 85 | °C | 3 | ||
| Supply Input Voltage VIN1, VIN2 | VIN1, VIN2 | -0.3 | 6.5 | V | 3 | ||
| LX1, LX2 Pin Voltage | VLX | -0.3 | V | 3 | |||
| Other Pins Voltage | -0.3 | 6.5 | V | 3 | |||
| Power Dissipation WDFN-10L 3x3 | PD | 1.471 | W | TA = 25°C | 3 | ||
| Lead Temperature (Soldering, 10 sec.) | 260 | °C | Soldering, 10 sec. | 3 | |||
| Junction Temperature | TJ | 150 | °C | 3 | |||
| Storage Temperature Range | TSTG | -65 | 150 | °C | 3 | ||
| ESD Susceptibility HBM | 2 | kV | Human Body Model | 3 | |||
| ESD Susceptibility MM | 200 | V | Machine Model | 3 | |||
| Package Thermal Resistance Junction-to-Ambient | θJA | 68 | °C/W | WDFN-10L 3x3, JEDEC 51-7 four-layer test board | 3 | ||
| Package Thermal Resistance Junction-to-Case | θJC | 7.8 | °C/W | WDFN-10L 3x3 | 3 |
CAD (KiCad official)
- Symbol:
RT8075ZQW - Footprint:
Package_DFN_QFN:WDFN-10-1EP_3x3mm_P0.5mm_EP1.8x2.5mm - 3D model: WDFN-10-EP(3x3), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.75 mm nominal WSON height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
rt8075zqw-etched.step/rt8075zqw-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rt8075zqw.step/rt8075zqw.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Richtek Tech datasheet (11 pp, sha256
82c82caa9e541979, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).