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Contents

README

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RT8072GSP

Richtek Tech · DC-DC Converters · SOP-8-EP

RT8072GSP from Richtek Tech, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 COMP passive Compensation node; the external RC/CC network connected here sets the loop compensation.
2 GND power_in Analog ground; layout guidance returns small-signal components to GND at one point connected to PGND close to the IC.
3 EN input Chip enable: drive high (>1.5V, <5.5V) to enable and low (<0.4V) to shut down, and it is internally pulled up to high when floating.
4 VIN power_in Power input with a 2.9V to 5.5V recommended supply range and a −0.3V to 6.5V absolute maximum rating.
5 BOOT power_in Bootstrap supply for the high-side gate driver; BOOT to LX must stay within −0.3V to 6V.
6 LX output Switch node connecting the internal power MOSFETs to the inductor, with high-frequency voltage swing that should be kept in a small, short-trace area.
7 RT passive Frequency setting: an external resistor to GND sets the switching frequency from 300kHz to 2MHz, and a floating pin gives 300kHz.
8 FB input Feedback voltage input, connected to the resistor divider between VOUT and GND to regulate against the 0.8V ±1% reference.
9 PGND power_in Power ground (exposed pad); the exposed pad must be soldered to a large PCB area connected to PGND for maximum power dissipation.

Key specifications

Parameter Value
Manufacturer Richtek Tech
Package SOP-8-EP
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Input Voltage VIN 2.9 5.5 V 5
Junction Temperature Range -40 125 °C 5
Ambient Temperature Range -40 85 °C 5
Supply Input Voltage VIN -0.3 6.5 V 5
BOOT to LX -0.3 6 V 5
Other Pins (upper limit printed as VIN + 0.3V) -0.3 V 5
Lead Temperature (Soldering, 10 sec.) 260 °C Soldering, 10 sec. 5
Junction Temperature 150 °C 5
Storage Temperature Range -65 150 °C 5
ESD Susceptibility HBM 2 kV HBM (Human Body Model) 5
Power Dissipation PD (SOP-8 Exposed Pad) PD 2.041 W TA = 25°C, SOP-8 (Exposed Pad) 5
Under Voltage Lockout Threshold VUVLO 2.6 2.8 V VIN Rising 5
Shutdown Current ISHDN 2 5 µA 5
Voltage Reference VREF 0.792 0.8 0.808 V 5
Enable Logic-High VIH 1.5 5.5 V 5
Enable Logic-Low VIL 0.4 V 5
Switching Frequency Setting range fOSC 300 2000 kHz 5
Current Limit Threshold 6 8 A 6
Package Thermal Resistance θJA θJA 49 °C/W SOP-8 (Exposed Pad) 5
Package Thermal Resistance θJC θJC 15 °C/W SOP-8 (Exposed Pad) 5

CAD (KiCad official)

  • Symbol: RT8072GSP
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOP-8-EP (KiCad packages3D, STEP)
  • 3D model files: rt8072gsp-etched.step / rt8072gsp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rt8072gsp.step / rt8072gsp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Richtek Tech datasheet (16 pp, sha256 0f452d39d45a6808, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF