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RT8010AGQW

Richtek Tech · DC-DC Converters · WQFN-16-EP(3x3)

RT8010AGQW from Richtek Tech, in a WQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin; connect to the system ground plane.
2 GND power_in Ground pin; connect to the system ground plane.
3 GND power_in Ground pin; connect to the system ground plane.
4 FB/VOUT bidirectional Feedback/output voltage pin: senses the output through the external divider in adjustable mode (VREF 0.6V typ.) and serves as the output voltage sense in fixed mode.
5 GND power_in Ground pin; connect to the system ground plane.
6 IC unconnected Internal connection; leave floating and do not make any connection to this pin.
7 EN input Chip enable, active high: EN high-level input is 1.5V min and EN low-level input is 0.4V max over VIN = 2.5V to 5.5V; pulling EN low puts the device in shutdown (less than 0.1µA typ.).
8 IC unconnected Internal connection; leave floating and do not make any connection to this pin.
9 VIN power_in Power input; pin 9 must be connected with pin 11 and pin 10 must be connected with pin 11. Supply range is 2.5V to 5.5V.
10 VIN power_in Power input; must be connected with pin 11. Supply range is 2.5V to 5.5V.
11 VIN power_in Power input; supply range is 2.5V to 5.5V, and pins 9 and 10 must be connected to this pin.
12 VIN power_in Power input; supply range is 2.5V to 5.5V.
13 LX output Switching node connected to the inductor; pin 13 must be connected with pin 14, and it should be kept as a short, wide trace with sensitive components kept away.
14 LX output Switching node connected to the inductor; must be connected with pin 13.
15 LX output Switching node pin for the internal power switches; connect to the inductor with a short, wide trace.
16 IC unconnected Internal connection; leave floating and do not make any connection to this pin.
17 GND power_in Exposed pad: must be soldered to a large PCB and connected to GND for maximum thermal dissipation (θJA 68°C/W on JEDEC 51-7 four-layer board).

Key specifications

Parameter Value
Manufacturer Richtek Tech
Package WQFN-16-EP(3x3)
Category Power Management (PMIC)
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage Range VIN 2.5 5.5 V 5
Quiescent Current IQ 50 70 A IOUT = 0mA, VFB = VREF + 5% 5
Shutdown Current ISHDN 0.1 1 A EN = GND 5
Reference Voltage VREF 0.588 0.6 0.612 V For adjustable output voltage 5
Output Voltage Accuracy, Adjustable VOUT -3 3 % VIN = VOUT + V to 5.5V (Note 6); 0A < IOUT < 1A 6
FB Input Current IFB 50 50 nA VFB = VIN 6
P-MOSFET RON RDS(ON)_P 0.28 Ω IOUT = 200mA, VIN = 3.6V 6
P-MOSFET RON RDS(ON)_P 0.38 Ω IOUT = 200mA, VIN = 2.5V 6
N-MOSFET RON RDS(ON)_N 0.25 Ω IOUT = 200mA, VIN = 3.6V 6
N-MOSFET RON RDS(ON)_N 0.35 Ω IOUT = 200mA, VIN = 2.5V 6
P-Channel Current Limit ILIM_P 1.4 2.1 3.2 A 6
EN High-Level Input Voltage VEN_H 1.5 V VIN = 2.5V to 5.5V 6
EN Low-Level Input Voltage VEN_L 0.4 V VIN = 2.5V to 5.5V 6
Under Voltage Lock Out threshold UVLO 1.8 V 6
UVLO Hysteresis 0.1 V 6
Oscillator Frequency fOSC 1.2 1.5 1.8 MHz VIN = 3.6V, IOUT = 100mA 6
Thermal Shutdown Temperature TSD 160 C 6
Max. Duty Cycle 100 % 6
LX Leakage Current 1 1 A VIN = 3.6V, VLX = 0V or VLX = 3.6V 6
Recommended Supply Input Voltage VIN 2.5 5.5 V 5
Junction Temperature Range TJ -40 125 °C 5
Ambient Temperature Range TA -40 85 °C 5
Supply Input Voltage VIN 6.5 V 5
EN, FB Pin Voltage -0.3 V Max is VIN (printed as −0.3V to VIN) 5
LX Pin Switch Voltage -0.3 V Max is VIN + 0.3V (printed as −0.3V to (VIN + 0.3V)) 5
LX Pin Switch Voltage (transient) -4.5 7.5 V <20ns 5
LX Pin Switch Current 2 A 5
Power Dissipation, WQFN-16L 3x3 PD 1.47 W TA = 25°C 5
Package Thermal Resistance, WQFN-16L 3x3, junction-to-ambient θJA 68 °C/W 5
Package Thermal Resistance, WQFN-16L 3x3, junction-to-case θJC 7.5 °C/W 5
Lead Temperature (Soldering) 260 °C 10 sec. 5
Storage Temperature Range TSTG -65 150 °C 5
Junction Temperature TJ 150 °C 5
ESD Susceptibility, HBM 2 kV Human Body Model 5

CAD (KiCad official)

  • Symbol: RT8010AGQW
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: WQFN-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: rt8010agqw-etched.step / rt8010agqw-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rt8010agqw.step / rt8010agqw.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Richtek Tech datasheet (16 pp, sha256 9b547835c2a23845, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF