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Contents

README

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RT6363GSP

Richtek Tech · DC-DC Converters · SOP-8-EP

RT6363GSP from Richtek Tech, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT passive Bootstrap capacitor connection node that supplies the high-side gate driver; connect a 0.1µF ceramic capacitor between this pin and SW.
2 VIN power_in Power input with an input voltage range of 4V to 60V; connect a suitable input capacitor to GND, usually two 2.2µF or larger ceramic capacitors with one typical value of 4.7µF.
3 EN input Enable control with an internal pull-up current source; float or drive to logic-high (≥1.2V) to enable the converter, and drive logic-low to force shutdown mode.
4 RT/SYNC input Frequency setting and external synchronization input; a resistor from this pin to GND sets the switching frequency, or a clock source can be tied here to synchronize to an external frequency.
5 FB input Output voltage sense input through a resistive divider, with a feedback reference voltage of 0.8V typically.
6 COMP passive Compensation node; external compensation elements connected to this pin stabilize the control loop.
7 GND power_in Ground pin that provides the ground return path for the control circuitry.
8 SW output Switch node that supplies power to the output; the output LC filter connects from SW to the output load.
9 PAD passive Exposed pad, internally unconnected, that must be soldered to a large PCB copper area for maximum power dissipation.

Key specifications

Parameter Value
Manufacturer Richtek Tech
Package SOP-8-EP
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage, VIN VIN -0.3 65 V 10
Enable Voltage, EN EN -0.3 65 V 10
Switch Voltage, SW SW -0.6 65 V 10
Switch Voltage, SW (transient) SW -5 70 V t ≤ 100ns 10
Power Good Voltage, PGOOD PGOOD -0.3 65 V 10
BOOT to SW voltage BOOT−SW -0.3 6 V 10
All Other Pins voltage -0.3 6 V All other pins 10
Lead Temperature (Soldering, 10 sec.) 260 °C 10 sec soldering 10
Junction Temperature TJ 150 °C 10
Storage Temperature Range TSTG -65 150 °C 10
Supply Input Voltage, VIN VIN 4 60 V 10
Output Voltage VOUT 0.8 V Upper limit printed as VIN 10
Junction Temperature Range TJ -40 125 °C 10
Input Operating Voltage VIN 4 60 V After soft-start is finished 11
VIN Under-Voltage Lockout Threshold (rising) VUVLOH 4.1 4.3 4.5 V VIN rising 11
VIN Under-Voltage Lockout Threshold (falling) VUVLOL 3.8 3.9 4 V VIN falling 11
Shutdown Current ISHDN 2.25 5 μA VEN = 0V 11
Quiescent Current IQ 100 135 μA VEN = 2V, VFB = 0.83V, not switching 11
Enable Threshold Voltage VTH_EN 1.1 1.2 1.3 V 11
Pull-Up Current (VTH_EN − 50mV) IEN 0.58 1.2 1.8 μA VTH_EN − 50mV 11
Hysteresis Current IEN_Hys 2.2 3.4 4.5 μA 11
Reference Voltage VREF 0.792 0.8 0.808 V 11
High-Side Switch On-Resistance RDS(ON)_H 80 150 mΩ VIN = 12V, VBOOT − VSW = 5V 11
Current Limit ILIM 4.675 5.5 6.325 A fSW = 500kHz, VOUT = 5V 11
Minimum On-Time tON_MIN 135 ns IOUT = 1A 12
Switching Frequency 1 fSW1 90 105 120 kHz RRT/SYNC = 1M 12
Switching Frequency 2 fSW2 450 500 550 kHz RRT/SYNC = 200k 12
Switching Frequency 3 fSW3 2200 2450 2700 kHz RRT/SYNC = 37.4k 12
SYNC Frequency Range 0.3 2.2 MHz External clock 12
Minimum Sync Pulse Width 20 ns 12
SYNC Threshold Voltage (high) VIH_SYNC 1.55 2 V 12
SYNC Threshold Voltage (low) VIL_SYNC 0.5 1.2 V 12
Soft-Start Period 1.4 2 2.6 ms 10% to 90%, RT6363GSP 12
Thermal Resistance, Junction-to-ambient (JEDEC standard) θJA 30.4 °C/W SOP-8 (Exposed pad) column 10
Thermal Resistance, Junction-to-case (top) θJC(Top) 73.9 °C/W SOP-8 (Exposed pad) column 10
Thermal Resistance, Junction-to-case (bottom) θJC(Bottom) 3.4 °C/W SOP-8 (Exposed pad) column 10
Thermal Resistance, Junction-to-ambient (specific EVB) θJA(EVB) 30 °C/W SOP-8 (Exposed pad) column 10
Junction-to-top characterization parameter ψJT 5 °C/W SOP-8 (Exposed pad) column 10
Junction-to-board characterization parameter ψJB 13.2 °C/W SOP-8 (Exposed pad) column 10

CAD (KiCad official)

  • Symbol: RT6363GSP
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOP-8-EP (KiCad packages3D, STEP)
  • 3D model files: rt6363gsp-etched.step / rt6363gsp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rt6363gsp.step / rt6363gsp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Richtek Tech datasheet (35 pp, sha256 ec0b54727fbce6c7, retrieved 2026-10-09, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF