component
RT6264BHGJ6F
Public Made by Adomby adom
Richtek Tech DC-DC Converters, TSOT-23-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 13d ago |
| viewers | 13d ago |
| package.json | 13d ago |
| page.json | 13d ago |
| README.md | 13d ago |
| rt6264bhgj6f-etched.glb | 13d ago |
| rt6264bhgj6f-etched.step | 13d ago |
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| rt6264bhgj6f.glb | 13d ago |
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| rt6264bhgj6f.step | 13d ago |
RT6264BHGJ6F
Richtek Tech · DC-DC Converters · TSOT-23-6
RT6264BHGJ6F from Richtek Tech, in a TSOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Power ground for the converter. |
| 2 | SW | output | Switch node between the internal switch and the synchronous rectifier; connect to the inductor and the bootstrap capacitor. |
| 3 | VIN | power_in | Power input with a supply range of 4.5V to 18V; connect input bypass capacitors directly to this pin and the GND pins, with MLCC capacitance higher than 20F recommended. |
| 4 | FB | input | Feedback voltage input connected to the midpoint of the external feedback divider; the device regulates FB to the feedback reference, typically 0.765V. |
| 5 | EN | input | Enable control input: logic high enables the device and connecting it to GND disables the device. |
| 6 | BOOT | passive | Bootstrap capacitor connection supplying the high-side gate driver; connect a 0.1F ceramic capacitor between this pin and the SW pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Richtek Tech |
| Package | TSOT-23-6 |
| Category | Power Management (PMIC) |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply input operating voltage | VIN | 4.5 | 18 | V | 8 | ||
| Under-voltage lockout threshold | VUVLO | 3.7 | 4 | 4.3 | V | 8 | |
| Shutdown current | ISHDN | 3 | 10 | µA | VEN = 0V | 8 | |
| Enable voltage threshold (high level) | VEN_H | 1.16 | 1.25 | 1.34 | V | 8 | |
| Enable voltage threshold (low level) | VEN_L | 1.01 | 1.1 | 1.19 | V | 8 | |
| EN pin pull-down resistance | REN_DN | 225 | 450 | 900 | kΩ | VEN = 12V | 8 |
| Feedback threshold voltage | VFB | 758 | 765 | 772 | mV | VOUT = 1.05V | 8 |
| Feedback input current | IFB | -0.1 | 0 | 0.1 | A | VFB = 0.8V, TA = 25°C | 8 |
| High-side switch current limit | ILIM_H | 5.4 | 6.5 | A | 8 | ||
| Low-side switch valley current limit | ILIM_L | 3.9 | 5.3 | A | 8 | ||
| Minimum off-time | tOFF_MIN | 200 | 260 | ns | VFB = 0.5V | 8 | |
| Recommended supply input voltage | VIN | 4.5 | 18 | V | 7 | ||
| Recommended junction temperature range | TJ | -40 | 125 | °C | 7 | ||
| Supply input voltage (absolute maximum) | VIN | -0.3 | 20 | V | 7 | ||
| Enable voltage (absolute maximum) | EN | -0.3 | 20 | V | 7 | ||
| Switch voltage (absolute maximum) | SW | -0.3 | 20.3 | V | 7 | ||
| Switch voltage transient (absolute maximum) | SW | -5 | 25 | V | < 100ns | 7 | |
| BOOT voltage (absolute maximum) | BOOT | -0.3 | 26 | V | 7 | ||
| BOOT to SW voltage (absolute maximum) | VBOOT, VSW | -0.3 | 6 | V | 7 | ||
| Feedback voltage (absolute maximum) | FB | -0.3 | 6 | V | 7 | ||
| Power dissipation TSOT-23-6 (FC) | PD | 1.69 | W | TA = 25°C | 7 | ||
| Lead temperature (soldering) | 260 | °C | 10 sec. | 7 | |||
| Junction temperature (absolute maximum) | TJ | 150 | °C | 7 | |||
| Storage temperature range | TSTG | -65 | 150 | °C | 7 | ||
| ESD susceptibility HBM | HBM | 2 | kV | Human Body Model (Note 2) | 7 | ||
| Junction-to-ambient thermal resistance (JEDEC) | θJA | 88.7 | °C/W | Note 4 and Note 5 | 7 | ||
| Junction-to-case (top) thermal resistance | θJC(Top) | 76.9 | °C/W | Note 4 and Note 5 | 7 | ||
| Junction-to-case (bottom) thermal resistance | θJC(Bottom) | 6 | °C/W | Note 4 and Note 5 | 7 | ||
| Junction-to-ambient thermal resistance (specific EVB) | θJA(EVB) | 59 | °C/W | Note 4 and Note 5 | 7 | ||
| Junction-to-top characterization parameter | ΨJC(Top) | 15.3 | °C/W | Note 4 and Note 5 | 7 | ||
| Junction-to-board characterization parameter | ΨJB | 30.19 | °C/W | Note 4 and Note 5 | 7 |
CAD (KiCad official)
- Symbol:
RT6264BHGJ6F - Footprint:
Package_TO_SOT_SMD:TSOT-23-6 - 3D model: TSOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
rt6264bhgj6f-etched.step/rt6264bhgj6f-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rt6264bhgj6f.step/rt6264bhgj6f.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Richtek Tech datasheet (25 pp, sha256
dd72b335e1083293, retrieved 2026-10-20, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).