# RT6217EHGJ8F

**Richtek Tech** · DC-DC Converters · TSOT-23-8

RT6217EHGJ8F from Richtek Tech, in a TSOT-23-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | MODE | input | Mode selection input: high forces CCM (connect to VIN with a 100k resistor), ground forces Pulse Skipping Mode at light load; do not float. |
| 2 | VIN | power_in | Power input with 4.5V to 24V input range; connect a suitable input capacitor (usually two 10µF or larger ceramic, typical 22µF) between this pin and GND. |
| 3 | SW | passive | Switch node between the internal switch and the synchronous rectifier; connect to the inductor and bootstrap capacitor. |
| 4 | GND | power_in | Power ground. |
| 5 | BOOT | passive | Bootstrap capacitor connection node supplying the high-side gate driver; connect a 0.1µF ceramic capacitor between this pin and SW. |
| 6 | EN | input | Enable control input: logic-high enables the converter, logic-low forces the device into shutdown mode. |
| 7 | NC | unconnected | No connection; this pin is left to float. |
| 8 | FB | input | Feedback voltage input connected to the midpoint of the external resistive divider; the device regulates FB at a typical threshold of 0.791V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Richtek Tech |
| Package | TSOT-23-8 |
| Category | Power Management ICs |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Input Operating Voltage | VIN | 4.5 |  | 24 | V |  | 6 |
| VIN UVLO Threshold | VUVLO | 3.7 | 3.9 | 4.1 | V | VIN rising | 6 |
| VIN UVLO Hysteresis | ΔVUVLO |  | 350 |  | mV |  | 6 |
| Supply Current (Shutdown) | ISHDN |  |  | 10 | µA | VEN = 0V | 6 |
| Supply Current (Quiescent) | IQ |  | 150 | 250 | µA | VEN = 2V, VFB = 1V, VMODE = 0V (Not Switching) | 6 |
| Internal Soft-Start Period | tSS |  | 1500 |  | µs | VFB from 0% to 100% | 6 |
| EN Rising Threshold | VENH | 1.2 | 1.4 | 1.6 | V |  | 6 |
| EN Hysteresis | ΔVEN | 80 | 150 | 220 | mV |  | 6 |
| Mode Input High Voltage | VMODEH | 2 |  |  | V |  | 7 |
| Mode Input Low Voltage | VMODEL |  |  | 0.4 | V |  | 7 |
| Feedback Voltage | VFB | 779 | 791 | 803 | mV |  | 7 |
| High-Side Switch-On Resistance | RDS(ON)_H |  | 85 |  | mΩ | VBOOT−VSW = 4.8V | 7 |
| Low-Side Switch-On Resistance | RDS(ON)_L |  | 40 |  | mΩ |  | 7 |
| Low-Side Switch Valley Current Limit | ILIM_L | 3.3 | 4.2 | 4.9 | A |  | 7 |
| High-Side Switch Peak Current Limit | ILIM_H |  | 5.5 |  | A |  | 7 |
| Switching Frequency | fSW |  | 500 |  | kHz |  | 7 |
| Maximum Duty Cycle | DMAX |  | 90 |  | % |  | 7 |
| Minimum On-Time | tON_MIN |  | 60 |  | ns |  | 7 |
| Thermal Shutdown | TSD |  | 160 |  | °C |  | 7 |
| Thermal Hysteresis | ΔTSD |  | 25 |  | °C |  | 7 |
| UVP Trip Threshold (UVP detect) |  |  | 50 |  | % | UVP detect | 7 |
| UVP Trip Threshold Hysteresis |  |  | 10 |  | % | Hysteresis | 7 |
| Supply Input Voltage (abs max) | VIN | -0.3 |  | 28 | V |  | 6 |
| Enable Pin Voltage (abs max) | EN | -0.3 |  | 28 | V |  | 6 |
| Switch Voltage (abs max) | SW | -0.3 |  | 28 | V |  | 6 |
| Switch Voltage transient (abs max) | SW | -5 |  | 30 | V | t ≤ 10ns | 6 |
| BOOT to SW (abs max) | VBOOT − VSW | -0.3 |  | 6 | V |  | 6 |
| BOOT Voltage (abs max) | VBOOT | -0.3 |  | 34 | V |  | 6 |
| Other Pins (abs max) |  | -0.3 |  | 6 | V |  | 6 |
| Power Dissipation | PD |  |  | 1.428 | W | TA = 25°C, TSOT-23-8 (FC) | 6 |
| Junction Temperature (abs max) | TJ |  |  | 150 | °C |  | 6 |
| Lead Temperature (Soldering) |  |  |  | 260 | °C | 10 sec. | 6 |
| Storage Temperature Range | TSTG | -65 |  | 150 | °C |  | 6 |
| ESD Susceptibility HBM | HBM |  |  | 2 | kV | Human Body Model | 6 |
| Supply Input Voltage (recommended) | VIN | 4.5 |  | 24 | V |  | 6 |
| Junction Temperature Range | TJ | -40 |  | 125 | °C |  | 6 |
| Ambient Temperature Range | TA | -40 |  | 85 | °C |  | 6 |
| Thermal Resistance Junction-to-Ambient | θJA |  | 70 |  | °C/W | TSOT-23-8 (FC), JEDEC 51-7 four-layer board | 6 |
| Thermal Resistance Junction-to-Case | θJC |  | 15 |  | °C/W | TSOT-23-8 (FC) | 6 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper |  | layer of copper area is filled. θJC is measured at the lead of the package. | 7 |

## CAD (KiCad official)

- Symbol: `RT6217EHGJ8F`
- Footprint: `Package_TO_SOT_SMD:TSOT-23-8`
- 3D model: TSOT-23-8 (KiCad packages3D, STEP)
- 3D model files: `rt6217ehgj8f-etched.step` / `rt6217ehgj8f-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `rt6217ehgj8f.step` / `rt6217ehgj8f.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Richtek Tech datasheet](docs/rt6217ehgj8f-datasheet.pdf) (19 pp, sha256 `aeb9ce02e4deaf86`, retrieved 2026-10-22, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/rt6217ehgj8f-datasheet.pdf)