RT2872GSP

{
 "schema": "adom.pads/1",
 "slug": "rt2872gsp",
 "footprint": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm",
 "generated_from": {
  "footprint": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm@sha256:5848244c5e72002e",
  "pins": "page.json:component.pins",
  "overrides": null
 },
 "pin1": {
  "pad": "1",
  "at": [
   -2.475,
   -1.905
  ],
  "corner": "top-left",
  "source": "silk-marker",
  "derived_from": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm@sha256:5848244c5e72002e"
 },
 "pad_count": 9,
 "symbol_pins": [
  "1",
  "2",
  "3",
  "4",
  "5",
  "6",
  "7",
  "8",
  "9"
 ],
 "paste_apertures": 4,
 "issues": [],
 "pads": [
  {
   "pad": "1",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    -2.475,
    -1.905
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "1",
   "name": "SW",
   "type": "power_out",
   "description": "Switch node. Drain of the high-side and low-side internal N-MOSFETs. Connect to the external inductor and to the boot capacitor return.",
   "is_pin1": true,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "2",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    -2.475,
    -0.635
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "2",
   "name": "BOOT",
   "type": "power_in",
   "description": "Bootstrap supply for the high-side N-MOSFET gate driver. Connect a ceramic capacitor (typ. 0.1µF) from BOOT to SW to develop the floating gate-drive rail.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "3",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    -2.475,
    0.635
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "3",
   "name": "EN",
   "type": "input",
   "description": "Chip enable. Drive high (>2.0V) to enable the converter, low (<0.4V) to disable. On the EVB, EN is pulled to VIN via a 100kΩ resistor (R4) for auto-enable operation.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "4",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    -2.475,
    1.905
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "4",
   "name": "GND",
   "type": "power_in",
   "description": "Device ground. Also tied to the exposed thermal pad on the underside of the SOP-8 package; solder the exposed pad to a ground copper plane for thermal dissipation.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "5",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    2.475,
    1.905
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "5",
   "name": "COMP",
   "type": "output",
   "description": "Error-amplifier output / loop compensation node. Connect an external RC network (typ. series R + C to GND) to set the loop bandwidth and phase margin of the current-mode control loop.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "6",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    2.475,
    0.635
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "6",
   "name": "FB",
   "type": "input",
   "description": "Feedback input to the internal error amplifier. Connect to the midpoint of the R1/R2 divider between VOUT and GND. Reference voltage is 0.8V; VOUT = 0.8V x (1 + R1/R2).",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "7",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    2.475,
    -0.635
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "7",
   "name": "RT",
   "type": "input",
   "description": "Oscillator frequency programming pin. Connect a resistor from RT to GND to set switching frequency between 300kHz and 1MHz (EVB uses 137kΩ / 113kΩ resistor on this pin).",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "8",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    2.475,
    -1.905
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "8",
   "name": "VIN",
   "type": "power_in",
   "description": "Main input supply, 4.5V to 36V. Bypass to GND with low-ESR ceramic capacitors (EVB uses 2x 10µF/50V X5R plus 0.1µF) placed close to the pin.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "9",
   "kind": "smd",
   "shape": "rect",
   "at": [
    0.0,
    0.0
   ],
   "rot": 0.0,
   "size": [
    2.41,
    3.3
   ],
   "layers": [],
   "thermal": true,
   "pin": "9",
   "name": "EP (GND)",
   "type": "power_in",
   "description": "Exposed thermal pad on the bottom of the package. Electrically tied to GND (pin 4). Must be soldered to a GND copper pour for proper thermal performance.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  }
 ]
}