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Contents

README

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RSU12N65D

REASUNOS · MOSFETs · TO-252

RSU12N65D from REASUNOS, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-to-source voltage is rated at ±30 V maximum, with a threshold of 3.5 to 4.5 V at ID=250 µA.
2 D passive Drain, also the exposed tab; drain-to-source voltage is rated at 650 V and continuous drain current is 12 A at TC=25℃.
3 S passive Source; continuous source current through the body diode is 12 A maximum.

Key specifications

Parameter Value
Manufacturer REASUNOS
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-Source Voltage VDSS 650 V 1
Continuous Drain Current ID 12 A TC=25℃ 1
Continuous Drain Current ID 7 A TC=100℃ 1
Pulsed Drain Current IDM 36 A 1
Power Dissipation PD 80 W 1
Gate-to-Source Voltage VGS -30 30 V 1
Single Pulse Avalanche Energy EAS 120 mJ L=10mH, VDS=50V, RG=25Ω, TC=25℃ 1
MOSFET dv/dt ruggedness dv/dt 50 V/ns VDS=0…400V 1
Reverse diode dv/dt dv/dt 15 V/ns VDS=0…400V, Tj=25℃, ISD≤ID 1
Maximum Temperature for Soldering Leads TL 300 ℃ Leads at 0.063in(1.6mm) from case for 10 seconds 1
Maximum Temperature for Soldering Package Body TPKG 260 ℃ Package body for 10 seconds 1
Operating Junction and Storage Temperature Range TJ and TSTG -55 150 ℃ 1
Junction-to-Case Thermal Resistance RθJC 1.56 ℃/W Drain lead soldered to water cooled heatsink, PD adjusted for a peak junction temperature of +150℃ 2
Junction-to-Ambient Thermal Resistance RθJA 68 ℃/W 1 cubic foot chamber, free air 2
Drain-to-Source Breakdown Voltage BVDSS 650 V VGS=0V, ID=250µA 2
Drain-to-Source Leakage Current IDSS 1 µA VDS=650V, VGS=0V 2
Gate-to-Source Forward Leakage Current IGSS 100 nA VGS=30V, VDS=0V 2
Gate-to-Source Reverse Leakage Current IGSS -100 nA VGS=-30V, VDS=0V 2
Static Drain-to-Source On-Resistance RDS(on) 390 450 mΩ VGS=10V, ID=6A 2
Gate Threshold Voltage VGS(TH) 3.5 4.5 V VGS=VDS, ID=250µA 2
Continuous Source Current (integral pn-diode in MOSFET) IS 12 A 3
Maximum Pulsed Current ISM 44 A 3
Diode Forward Voltage VSD 0.9 1.2 V IS=12A, VGS=0V 3

CAD (KiCad official)

  • Symbol: RSU12N65D
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: rsu12n65d-etched.step / rsu12n65d-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rsu12n65d.step / rsu12n65d.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: REASUNOS datasheet (8 pp, sha256 f84510f774deca74, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF